Datasheet Texas Instruments TDA2HGBRQABCRQ1 — 数据表

制造商	Texas Instruments
系列	TDA2HG
零件号	TDA2HGBRQABCRQ1

适用于ADAS应用的SoC处理器，带有图形，视频和视觉加速功能760-FCBGA -40至125

数据表

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PDF, 6.4 Mb, 修订版: C, 档案已发布: Jun 6, 2017

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价格

状态

Lifecycle Status	Active (Recommended for new designs)
Manufacture's Sample Availability	No

打包

Pin	760	760
Package Type	ABC	ABC
Industry STD Term	FCBGA	FCBGA
JEDEC Code	S-PBGA-N	S-PBGA-N
Package QTY	250	250
Carrier	JEDEC TRAY (5+1)	JEDEC TRAY (5+1)
Device Marking	TDA2HGBRQABCQ1	TDA
Width (mm)	23	23
Length (mm)	23	23
Thickness (mm)	2.39	2.39
Pitch (mm)	.8	.8
Max Height (mm)	2.96	2.96
Mechanical Data	下载	下载

参数化

ARM CPU	1 ARM Cortex-A15
ARM MHz	500,750 Max.
CSI-2	N/A
Co-Processor	4 ARM Cortex-M4 s
DSP	2 C66x
DSP MHz	500,750 Max.
Display Options	1 HDMIOUT,3 LCD OUT
EMAC	10/100/1000,2-port 1Gb switch
EMIF	2 DDR2,2 DDR3,2 DDR3L
Embedded Vision Engine	2 EVE
Embedded Vision Engine (EVE)	650,500 Max
Graphics Acceleration	1 2D,2 3D
Hardware Accelerators	1 Image Video Accelerator,2 Viterbi Decoder,Audio Tracking
MMC/SD	1x SDIO 4b,1x SDIO 8b,1x UHSI 4b,1x eMMC 8b
McASP	8
Other On-Chip Memory	2.5 MB
PCIe	2 PCIe Gen3
Serial I/O	I2C,UART,SPI,CAN,USB
Video Input Ports	10

生态计划

RoHS

Compliant

设计套件和评估模块

Evaluation Modules & Boards: TDA2EVM5777
TDA2x Vision EVM Kit вЂ“ Spectrum Digital (Includes CPU Board and Vision Application Board)
Lifecycle Status: Active (Recommended for new designs)
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应用须知

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DSS Bit Exact Output
PDF, 115 Kb, 档案已发布: Jan 11, 2016
The display subsystem (DSS) in TDA2xx, TDA2Ex and TDA3xx platform is used for displaying video data to external devices. But DSS can also be used as a high-speed data transfer port for any non video data. One of the basic requirements of the data transfer port is that the data that is present in the memory should not be modified before the data is sent out, which means the data sent should be bit
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Quad Channel Camera Application for Surround View and CMS Camera Systems (Rev. A)
PDF, 485 Kb, 修订版: A, 档案已发布: Aug 23, 2016
This application report discusses in detail a reference design jointly developed between OmniVision Technologies, Inc. and Texas Instruments, Inc. It interconnects Megapixel Image Sensors with the TDA2x ADAS Applications Processor. In order to bridge long distances over coax cables, TI's FPD-Link III technology comes into play. The concept proves a method over which continuous high speed transfers
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DSS BT656 Workaround for TDA2x
PDF, 141 Kb, 档案已发布: Mar 29, 2016
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TDA2x/TDA2E Performance
PDF, 6.6 Mb, 档案已发布: Jul 19, 2016
This application report provides information on the TDA2xx and TDA2ex device throughput performances and describes the TDA2xx and TDA2ex System-on-Chip (SoC) architecture, data path infrastructure, and constraints that affect the throughput and different optimization techniques for optimum system performance. This document also provides information on the maximum possible throughput performance of
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ADAS Power Management
PDF, 1.3 Mb, 档案已发布: Mar 7, 2016
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A Guide to Debugging With CCS on the DRA75x, DRA74x, TDA2x and TDA3x Family of D (Rev. A)
PDF, 3.2 Mb, 修订版: A, 档案已发布: Aug 19, 2016
Being able to look into the state of the device when an application fails to run as expected is a key enabler while debugging the application. This application report walks through the different steps required to setup the TI Code Composer Studioв„ў (CCS), as well as how to debug applications on the DRA7x, TDA2x and TDA3x family of devices. The document starts with describing basic CCS debugging tec
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Guide to fix Perf Issues Using QoS Knobs for DRA74x, DRA75x, TDA2x & TD3x Device
PDF, 612 Kb, 档案已发布: Aug 13, 2014
This application report provides a methodology through which performance issues can be identified and fixed in systems using DRA74x, DRA75x, TDA2x and TDA3x family of devices.
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Quality of Service (QoS) Knobs for DRA74x, DRA75x & TDA2x Family of Devices (Rev. A)
PDF, 148 Kb, 修订版: A, 档案已发布: Dec 15, 2016
This application report lists various quality-of-service (QoS) knobs that are implemented in DRA74x, DRA75x and TDA2x system-on-chip (SoC) family of devices. These QoS knobs aid to optimize overall system performance while running several concurrent application scenarios.
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ECC/EDC on TDAxx (Rev. A)
PDF, 109 Kb, 修订版: A, 档案已发布: Jul 5, 2017
TDA2x and TDA3x series of automotive processor are designed to be used in automotive safety systems. To enable safety, these processors come with error detection and correction (EDC) support for various memories. This application report provides an overview and usage description of EDC.
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Optimizing DRA7xx and TDA2xx Processors for use with Video Display SERDES (Rev. A)
PDF, 132 Kb, 修订版: A, 档案已发布: Jun 14, 2017
The purpose of this application report is to provide guidance on configuring DRA7xx and TDA2xx processors to meet video Serializer/Deserializer (SerDes) jitter requirements.
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EMIF Tools (Rev. A)
PDF, 207 Kb, 修订版: A, 档案已发布: Jun 5, 2017
At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes

模型线

系列: TDA2HG (4)

TDA2HGBDQABCQ1 TDA2HGBDQABCRQ1 TDA2HGBRQABCQ1 TDA2HGBRQABCRQ1

制造商分类

Semiconductors > Processors > Automotive Processors > TDAx ADAS SoCs