Datasheet Texas Instruments TMS320C6657 — 数据表

制造商	Texas Instruments
系列	TMS320C6657

数据表

价格

状态

打包

参数化

Parameters / Models	TMS320C6657CZH	TMS320C6657CZH25	TMS320C6657CZH8	TMS320C6657CZHA	TMS320C6657CZHA25	TMS320C6657GZHA	TMS320C6657SCZH
Applications	Avionics & Defense,Communications,Machine Vision	Avionics & Defense,Communications,Machine Vision	Avionics & Defense,Communications,Machine Vision	Avionics & Defense,Communications,Machine Vision	Avionics & Defense,Communications,Machine Vision	Avionics & Defense,Communications,Machine Vision	Avionics & Defense,Communications,Machine Vision
DRAM	DDR3	DDR3	DDR3	DDR3	DDR3	DDR3	DDR3
DSP	2 C66x	2 C66x	2 C66x	2 C66x	2 C66x	2 C66x	2 C66x
DSP MHz, Max.	1000,1250	1000,1250	1000,1250	1000,1250	1000,1250	1000,1250	1000,1250
EMAC	10/100/1000	10/100/1000	10/100/1000	10/100/1000	10/100/1000	10/100/1000	10/100/1000
GFLOPS	32,40	32,40	32,40	32,40	32,40	32,40	32,40
Hardware Accelerators	VCP2,TCP3d	VCP2,TCP3d	VCP2,TCP3d	VCP2,TCP3d	VCP2,TCP3d	VCP2,TCP3d	VCP2,TCP3d
On-Chip L2 Cache	2048 KB	2048 KB	2048 KB	2048 KB	2048 KB	2048 KB	2048 KB
Operating Temperature Range, C	-40 to 100,0 to 85	-40 to 100,0 to 85	-40 to 100,0 to 85	-40 to 100,0 to 85	-40 to 100,0 to 85	-40 to 100,0 to 85	-40 to 100,0 to 85
Other On-Chip Memory	1024 KB	1024 KB	1024 KB	1024 KB	1024 KB	1024 KB	1024 KB
PCI/PCIe	2 PCIe Gen2	2 PCIe Gen2	2 PCIe Gen2	2 PCIe Gen2	2 PCIe Gen2	2 PCIe Gen2	2 PCIe Gen2
Package Size: mm2:W x L, PKG	See datasheet (FCBGA)	See datasheet (FCBGA)	See datasheet (FCBGA)	See datasheet (FCBGA)	See datasheet (FCBGA)	See datasheet (FCBGA)	See datasheet (FCBGA)
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Serial I/O	Hyperlink,I2C,RapidIO,SPI,TSIP,UART	Hyperlink,I2C,RapidIO,SPI,TSIP,UART	Hyperlink,I2C,RapidIO,SPI,TSIP,UART	Hyperlink,I2C,RapidIO,SPI,TSIP,UART	Hyperlink,I2C,RapidIO,SPI,TSIP,UART	Hyperlink,I2C,RapidIO,SPI,TSIP,UART	Hyperlink,I2C,RapidIO,SPI,TSIP,UART
Serial RapidIO	1 (four lanes)	1 (four lanes)	1 (four lanes)	1 (four lanes)	1 (four lanes)	1 (four lanes)	1 (four lanes)
Total On-Chip Memory, KB	3200	3200	3200	3200	3200	3200	3200

生态计划

应用须知

• 下载
  PCI Express (PCIe) Resource Wiki for Keystone Devices (Rev. A)
  PDF, 57 Kb, 修订版: A, 档案已发布: May 19, 2017
• 下载
  Keystone NDK FAQ
  PDF, 54 Kb, 档案已发布: Oct 3, 2016
  This document is a collection of frequently asked questions (FAQ) on running the NDK examples on the KeyStoneв„ў family of devices.
• 下载
  TI Keystone DSP Hyperlink SerDes IBIS-AMI Models
  PDF, 3.2 Mb, 档案已发布: Oct 9, 2014
  This document describes the organization, structure, and proper usage of the TI serializer and deserializer (SerDes) IBIS-AMI models for Keystone DSP Hyperlink interface.
• 下载
  TI Keystone DSP PCIe SerDes IBIS-AMI Models
  PDF, 4.8 Mb, 档案已发布: Oct 9, 2014
  This document describes the organization, structure, and proper usage of the TI serializer and deserializer (SerDes) IBIS-AMI models for Keystone DSP PCIe interface.
• 下载
  SerDes Implementation Guidelines for KeyStone I Devices
  PDF, 590 Kb, 档案已发布: Oct 31, 2012
  The goal of KeyStone I SerDes collateral material is to make system implementation easier for the customer by providing the system solution. For these SerDes-based interfaces, it is not assumed that the system designer is familiar with the industry specifications, SerDes technology, or RF/microwave PCB design. However, it is still expected that the PCB design work will be supervised by a knowledge
• 下载
  Hardware Design Guide for KeyStone Devices (Rev. C)
  PDF, 1.7 Mb, 修订版: C, 档案已发布: Sep 15, 2013
• 下载
  KeyStone I DDR3 Initialization (Rev. E)
  PDF, 114 Kb, 修订版: E, 档案已发布: Oct 28, 2016
  The initialization of the DDR3 DRAM controller on KeyStone I DSPs is straightforward as long as the proper steps are followed. However, if some steps are omitted or if some sequence-sensitive steps are implemented in the wrong order, DDR3 operation will be unpredictable.All DDR3 initialization routines must contain the basic register writes to configure the memory controller within the DSP
• 下载
  TMS320C66x DSP Generation of Devices (Rev. A)
  PDF, 245 Kb, 修订版: A, 档案已发布: Apr 25, 2011
• 下载
  AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
  PDF, 2.2 Mb, 修订版: A, 档案已发布: May 1, 2004
  Application Note 1281 Bumped Die (Flip Chip) Packages
• 下载
  SERDES Link Commissioning on KeyStone I and II Devices
  PDF, 138 Kb, 档案已发布: Apr 13, 2016
  The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
• 下载
  PCIe Use Cases for KeyStone Devices
  PDF, 320 Kb, 档案已发布: Dec 13, 2011
• 下载
  Clocking Design Guide for KeyStone Devices
  PDF, 1.5 Mb, 档案已发布: Nov 9, 2010
• 下载
  Optimizing Loops on the C66x DSP
  PDF, 585 Kb, 档案已发布: Nov 9, 2010
• 下载
  The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)
  PDF, 20 Kb, 修订版: A, 档案已发布: Nov 10, 2010
  The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM
• 下载
  DDR3 Design Requirements for KeyStone Devices (Rev. B)
  PDF, 582 Kb, 修订版: B, 档案已发布: Jun 5, 2014
• 下载
  Multicore Programming Guide (Rev. B)
  PDF, 1.8 Mb, 修订版: B, 档案已发布: Aug 29, 2012
  As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore
• 下载
  TI DSP Benchmarking
  PDF, 62 Kb, 档案已发布: Jan 13, 2016
  This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
• 下载
  Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
  PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
  This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
• 下载
  Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
  PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015

模型线

制造商分类

• Semiconductors> Processors> Digital Signal Processors> C6000 DSP> C66x DSP