Datasheet Texas Instruments TMS320DM355 — 数据表

制造商	Texas Instruments
系列	TMS320DM355

数据表

价格

状态

打包

参数化

Parameters / Models	DM355SDZCEA216	TMS320DM355CZCE216	TMS320DM355CZCEA13	TMS320DM355CZCEA21	TMS320DM355DZCE135	TMS320DM355DZCE216	TMS320DM355DZCE270	TMS320DM355DZCEA21
ARM CPU			1 ARM9
ARM MHz (Max.)			135 216 270
Applications			Consumer Electronics Energy Industrial Medical SecurityVideo and Imaging
Approx. Price (US$)			15.91 | 1ku
DRAM			LPDDR DDR2
I2C			1
Operating Systems			Neutrino PrOS Integrity Windows Embedded CE Linux
Operating Temperature Range(C)			-40 to 100
Pin/Package			337NFBGA
Rating			Catalog
SPI			3
UART(SCI)			3
USB			1
Video Acceleration			1 MJCP
Video Port (Configurable)			1 Dedicated Input 1 Dedicated Output
Video Resolution/Frame Rate			D1 or Less 720p

生态计划

应用须知

• 下载
  Implementing DDR2/mDDR PCB Layout on the TMS320DM35x DMSoC (Rev. D)
  PDF, 127 Kb, 修订版: D, 档案已发布: Nov 11, 2009
  the TMS320DM35x Digital Media System-on-Chip (DMSoC) device. The approach to specifying interface timing for the DDR2/mDDR interface is quite different than on previous devices.The previous approach specified device timing in terms of data sheet specifications and simulation models. The system designer was required to obtain compatible memory devices, as well as the device-specific data sheet
• 下载
  TMS320DM355 Power Consumption for Common Application Usage Scenarios (Rev. A)
  PDF, 53 Kb, 修订版: A, 档案已发布: Jul 16, 2010
  This document discusses the power consumption for common system application usage scenarios for the TMS320DM355 digital media system-on-chip (DMSoC) processor. Power consumption is highly dependent on the individual user's application; however, this document focuses on providing several DM355 application-usage case scenarios and the environment settings that were used to perform such power measure
• 下载
  TMS320DM355/335 Migration Guide (Silicon revision 1.1, 1.3 and 1.4) (Rev. B)
  PDF, 75 Kb, 修订版: B, 档案已发布: Jan 5, 2011
  This application report describes the differences between Silicon revision 1.1, 1.3 and 1.4 of the TMS320DM355/DM335 digital media system-on-chip (DMSoC). This document discusses behavior different from that described in the TMS320DM355 Digital Media System-on-Chip (DMSoC) ARM Subsystem User's Guide (SPRUFB3) and the TMS320DM335 Digital Med
• 下载
  Migrating From TMS320DM35x to TMS320DM36x Devices (Rev. A)
  PDF, 79 Kb, 修订版: A, 档案已发布: Jun 2, 2011
  For purposes of comparison, this application report describes the key features of the TMS320DM36x (DM36x) and the TMS320DM35x (DM35x) digital media processors.
• 下载
  Powering the TMS320DM335 and TMS320DM355 with the TPS650061
  PDF, 144 Kb, 档案已发布: Oct 13, 2011
  TPS650061, TMS320DM335, TMS320DM355 Powering the DM335 and DM355 with the TPS650061
• 下载
  TMS320DM355 DSP Power Reference Design PR742 (Rev. A)
  PDF, 199 Kb, 修订版: A, 档案已发布: Aug 8, 2008
  This reference design is for the TMS320DM335/DM355 digital signal processor (DSP) and accounts for voltage, current, and sequencing requirements. The operating input voltage ranges from 2 V to 5.5 V for Li-ion batteries and 3 AA batteries. This design also can work with 2 AA batteries with some limitations. The design is optimized for efficiency over the full range of operation and low overall cos
• 下载
  USB Compliance Checklist (Rev. A)
  PDF, 72 Kb, 修订版: A, 档案已发布: Mar 10, 2010
• 下载
  LSP 2.10 DaVinci Linux Drivers (Rev. A)
  PDF, 1.2 Mb, 修订版: A, 档案已发布: Jul 8, 2009
• 下载
  Building a Small Embedded Linux Kernel Example (Rev. A)
  PDF, 1.3 Mb, 修订版: A, 档案已发布: May 27, 2008
  Building a Small Embedded Linux Kernel Example Application Report
• 下载
  EDMA v2.0 to EDMA v3.0 (EDMA3) Migration Guide (Rev. A)
  PDF, 292 Kb, 修订版: A, 档案已发布: Aug 21, 2008
  This application report summarizes the key differences between the enhanced direct memory access (EDMA3) used on C64x+в„ў DSP devices and the EDMA2 used on TMS320C64xв„ў DSP devices, and provides guidance for migrating from EDMA2 to EDMA3.
• 下载
  Understanding TI's PCB Routing Rule-Based DDR Timing Specification (Rev. A)
  PDF, 93 Kb, 修订版: A, 档案已发布: Jul 17, 2008
  This application report motivates the way the DDR high-speed timing requirements are now going to be communicated to system designers. The traditional method of using data sheet parameters and simulation models is tedious. The system designer uses this information to evaluate whether timing specifications are met and can be expected to operate reliably.Ultimately, the real question the hardwa
• 下载
  High-Speed Interface Layout Guidelines (Rev. G)
  PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
  As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

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制造商分类

• Semiconductors> Processors> Digital Signal Processors> Media Processors > DaVinci Video Processors