Plastic Packages for Integrated Circuits Package Outline Drawing
V256.17x17C
256 PLASTIC BALL GRID ARRAY PACKAGE (PBGA)
Rev 0, 6/13
Г?0.50(3X). REF COMMON
SYMBOL DIEMENSIONS 1 2 3 4 5 6 7 8 9 10 1112 13 14 15 16 Package PBGA Body Size X D 17.00 Y E 17.00 X eD 1.000 Y eE 1.000 Total Thickness A 1.810 В±0.190 Mold Thickness A3 0.850 Ref. Substrate Thickness A2 0.560 Ref. Ball Diameter 0.500 Stand Off A1 0.300 ~ 0.500 Ball Width b 0.400 ~ 0.600 Mold Area CA(4X) X M 15.000 Y N 15.000 Chamfer CA 1.215*45В°. Package Edge Tolerance aaa 0.200 Substrate Flatness bbb 0.250 Mold Flatness ccc 0.350 Coplanarity ddd 0.150 Ball Offset (Package) eee 0.250 Ball Offset (Ball) fff 0.100 Ball Count n 256 X D1 15.000 Y E1 15.000 M Г?eee M C A B
Г?b(n X)
16 15 14 13 1211 10 9 8 7 6 5 4 3 2 1 E E1 eE A
B
C
D
E
F
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H
J
K
L
M
N
P
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