Package Intersil V356.27x27C — 数据表
356球型散热器塑料球栅阵列封装(HPBGA)
Package Outline Drawing (POD)
参数化
Family | HBGA |
Pin Count | 356 |
Length | 27.00 mm |
Width | 27.00 mm |
Weight | 2.61 g |
Pitch | 1.27 mm |
Lead Free Peak Temperature | 260 °C |
Features | Heat-Sink |
Package Index | V356.27X27C |
模型线
系列: BGA (14)
制造商分类
- Plastic Packages