Package Intersil V416.27x27 — 数据表
416塑料球栅阵列封装(下腔)
Package Outline Drawing (POD)
参数化
Family | PBGA |
Pin Count | 416 |
Weight | 2.28 g |
Pitch | 25.40 mm |
Peak Temperature | 235 °C |
Lead Free Peak Temperature | 260 °C |
Features | Plastic |
Package Index | V416.27X27 |
模型线
系列: BGA (14)
制造商分类
- Plastic Packages