Package Outline Drawing
Y22.19x13
22 I/O 19mmx13mmx5.30mm HDA MODULE
Rev 1, 11/16 0.10 M C A B
0.05 M C 1 B 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 13.00 A
B
C
D
E 12.00 F
G
H
J
K
L
M 0.10 C 2X
18.00 0.10 C 2X DATUM B DATUM A 0.10 M C A B
TOP VIEW BOTTOM VIEW 2 1.00
0.10 C 0.50 REF. 5.30 MAX 0.50 REF.
3 0.08 C SEATING
C PLANE 0.025 17x0.60 В±0.05 0.10 M 2 C A B 1.00 0.05 M C SIDE VIEW
R0.100 REF. 3 17x0.60 В±0.05 NOTES:
1. All dimensions are in millimeters. 2. Represents the basic land grid pitch. 3. These 17 I/Os are centered in a fixed row
and column matrix at 1.0mm pitch BSC. 4. Dimensioning and tolerancing per ASME Y14.5-2009. 5. Tolerance for exposed PAD edge location dimension is В±0.1mm. DETAIL A …
