Plastic Packages for Integrated Circuits
Metric Plastic Quad Flatpack Packages (MQFP)
D MDP0055 D1 14x20mm 128 LEAD MQFP (WITH AND WITHOUT HEAT
SPREADER) 3.2mm FOOTPRINT 128
PIN 1 ID
1 DIMENSIONS
(MILLIMETERS) A Max 3.40 20.000 В±0.100
(E1) 19.870 В±0.100 18.500 REF E1 E SYMBOL 12.500 REF C0.600x0.350
(4X) 13.870 В±0.100
A 1 A 14.000 В±0.100
(D1) 12В° ALL
AROUND Y
b T1 T REMARKS
Overall height A1 0.250~0.500 Standoff A2 2.750 В±0.250 Package thickness О± 0В°~7В° b 0.220 В±0.050 Foot angle b1 0.200 В±0.030 D 17.200 В±0.250 Lead width 1
Lead base metal width 1
Lead tip to tip D1 14.000 В±0.100 Package length E 23.200 В±0.250 Lead tip to tip E1 20.000 В±0.100 Package width e 0.500 Base Lead pitch L 0.880 В±0.150 Foot length L1 1.600 Ref. Lead length T 0.170 В±0.060 Frame thickness 1 T1 0.152 В±0.040 ccc 0.100 Frame base metal thickness 1
Foot coplanarity ddd 0.100 Foot position
Rev. 2 2/07 b1 NOTES: 1 SECTION A-A DROP IN HEAT SPREADER
4 STAND POINTS EXPOSED 1. General tolerance: Distance В±0.100, Angle +2.5В°.
2. 1 Matte finish on package body surface except ejection and
pin 1 marking (Ra 0.8~2.0um). 3. All molded body sharp corner RADII unless otherwise specified
(Max RO.200).
4. Package/Leadframe misalignment (X, Y): Max. 0.127 …
