Plastic Packages for Integrated Circuits Package Outline Drawing
Q208.28x28D
208 LEAD PLASTIC QUAD FLATPACK PACKAGE (PQFP)
Rev 0, 12/12
MILLIMETERS D SYMBOL MIN NOM MAX MIN NOM MAX D2 A -4.10 -0.161 A1 0.25 -0.010 -A2 3.20 3.32 3.60 -D-E2 D 30.60 BSC
28.00 BSC 1.102 BSC E 30.60 BSC 1.205 BSC 28.00 BSC
-0.25 0.003 -R1 0.08 -0.003 -Оё 0В° 3.5В° 7В° 0В° 3.5В° 7В° Оё1 0В° -0В° -8В° REF Оё3 e b bbb H A-B D 0.09 L 0.45 TOP VIEW
16.00 0.010 8В° REF 8В° REF c
L1 ddd M C A-B s D s 1.102 BSC 0.08 4X
aaaC A-B D
4X 1.205 BSC R2 Оё2 8В° REF 0.15 0.20 0.004 0.006 0.008 0.60 0.75 0.018 0.024 0.030 1.30 REF 0.051 REF S 0.20 -b 0.17 0.20 0.27 0.008 -0.007 0.008 0.011 4.
R
00 e 0.50 BSC 0.020 BSC D2 25.50 1.004 E2 25.50 1.004 TOLERANCES OF FORM AND POSITION 16.00 E -B-0.126 0.131 0.142 D1
E1
-AE1 INCHES D1 aaa 0.20 0.008 bbb 0.20 0.008 ccc -0.08 -0.003 -ddd -0.08 -0.003 -NOTES:
1. Dimensions D1 and E1 do not include mold protrusion.
2. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm. Dambar
cannot be located on the lower radius or the foot. Minimum
space between protrusion and an adjacent lead shall not be
less than 0.07mm.
3. The top package body size may be smaller than the bottom …