Plastic Packages for Integrated Circuits
Small Outline Exposed Pad Plastic Packages (EPSOIC)
M8.15C N
INDEX
AREA H 0.25(0.010) M 8 LEAD NARROW BODY SMALL OUTLINE EXPOSED PAD
PLASTIC PACKAGE B M E INCHES
-B-1 2 SYMBOL 3 TOP VIEW
L
SEATING PLANE
-A-A D
-C-e О±
A1 B
0.25(0.010) M C
0.10(0.004) C A M B S SIDE VIEW MILLIMETERS MAX MIN MAX NOTES A 0.056 0.066 1.43 1.68 -A1 0.001 0.005 0.03 0.13 -B 0.0138 0.0192 0.35 0.49 9 C 0.0075 0.0098 0.19 0.25 -D 0.189 0.196 4.80 4.98 3 E 0.150 0.157 3.811 3.99 4 e h x 45В° MIN 0.050 BSC 1.27 BSC -H 0.230 0.244 5.84 6.20 -h 0.010 0.016 0.25 0.41 5 L 0.016 0.035 0.41 0.89 6 8В° 0В° N О± 8
0В° 8 7
8В° -P -0.126 -3.200 11 P1 -0.099 -2.514 11
Rev. 1 6/05 NOTES:
1 2 1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95. 3 2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
P1 3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. …
