Package Intersil W3x4.12 — 数据表

制造商Intersil
系列WLCSP
零件号W3x4.12
Package Intersil W3x4.12

3x4阵列12球晶圆级芯片级封装(WLCSP)

Package Outline Drawing (POD)

PDF, 40 Kb
从文件中提取

参数化

FamilyWLCSP-BP
Pin Count12
Length1.70 mm
Width1.30 mm
Thickness0.31 mm
Height max0.55 mm
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW3X4.12

模型线

制造商分类

  • Plastic Packages