Package Intersil W4x4.16C — 数据表

制造商Intersil
系列WLCSP
零件号W4x4.16C
Package Intersil W4x4.16C

4x4阵列16球晶圆级芯片级封装(WLCSP)

Package Outline Drawing (POD)

PDF, 70 Kb
从文件中提取

参数化

FamilyWLCSP-TCURDL
Pin Count16
Length2.16 mm
Width2.16 mm
Thickness0.60 mm
Height max0.66 mm
Pitch0.50 mm
Lead Free Peak Temperature260 °C
Package IndexW4X4.16C

模型线

制造商分类

  • Plastic Packages