Package Intersil W9x9.62 — 数据表

制造商Intersil
系列WLCSP
零件号W9x9.62
Package Intersil W9x9.62

9x9阵列62球,采用0.40节距晶圆级芯片规模封装

Package Outline Drawing (POD)

PDF, 157 Kb
从文件中提取

参数化

FamilyWLCSP-BP
Pin Count62
Length3.69 mm
Width3.69 mm
Height max0.02 mm
Weight0.010258257 g
Pitch0.02 mm
Lead Free Peak Temperature260 °C
Package IndexW9X9.62

模型线

制造商分类

  • Plastic Packages