Datasheet Texas Instruments HPA01108AIYZFR — 数据表
| 制造商 | Texas Instruments |
| 系列 | TMP006 |
| 零件号 | HPA01108AIYZFR |
WCSP封装中的红外热电堆非接触式温度传感器8-DSBGA -40至125
数据表
TMP006/B Infrared Thermopile Sensor in Chip-Scale Package datasheet
PDF, 725 Kb, 修订版: E, 档案已发布: Apr 9, 2015
价格
状态
| Lifecycle Status | NRND (Not recommended for new designs) |
| Manufacture's Sample Availability | No |
打包
| Pin | 8 |
| Package Type | YZF |
| Industry STD Term | DSBGA |
| JEDEC Code | S-XBGA-N |
| Package QTY | 3000 |
| Carrier | LARGE T&R |
| Device Marking | TMP006 |
| Width (mm) | 1.75 |
| Length (mm) | 1.75 |
| Pitch (mm) | .5 |
| Max Height (mm) | .625 |
| Mechanical Data | 下载 |
生态计划
| RoHS | Compliant |
设计套件和评估模块
- Evaluation Modules & Boards: TMP006EVM
TMP006 Evaluation Module
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: BOOSTXL-SENSHUB
Sensor Hub BoosterPack
Lifecycle Status: Active (Recommended for new designs) - Development Kits: BOOSTXL-EDUMKII
Educational BoosterPack MKII
Lifecycle Status: Active (Recommended for new designs)
应用须知
- TMP006 and TMP007: Through-Hole Mounting MethodPDF, 1.8 Mb, 档案已发布: Sep 1, 2016
This applicationnotedescribesa new methodof mountingTMP007WCSPdie on the printed-circuitboard(PCB).The advantagesof the new methodare describedand mountingrecommendationsare provided.All of the followingrecommendationsand conclusionsare also true for TMP006parts. - AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AG)PDF, 13.7 Mb, 修订版: AG, 档案已发布: Aug 12, 2015
- Understanding the I2C BusPDF, 124 Kb, 档案已发布: Jun 30, 2015
模型线
系列: TMP006 (5)
- HPA01108AIYZFR TMP006AIYZFR TMP006AIYZFT TMP006BIYZFR TMP006BIYZFT
制造商分类
- Semiconductors > Sensing Products > Temperature Sensors > Cable & Probe Temperature Sensors