Package Linear Technology TSSOP-16/2 — 数据表

FE Package
16-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663 Rev K)
Exposed Pad Variation BC 4.60
3.58
(.141) 4.90 – 5.10*
(.193 – .201) 16 1514 13 12 11 SEE NOTE 5 6.60 ±0.10
4.50 В±0.10 0.48
(.019)
REF 3.58
(.141) 2.94
(.116) 10 9 DETAIL B 6.40
2.94
(.252)
(.116)
BSC SEE NOTE 4 0.45 В±0.05
1.05 В±0.10
0.65 BSC
1 2 3 4 5 6 7 8 RECOMMENDED SOLDER PAD LAYOUT 4.30 – 4.50*
(.169 – .177) 0.09 – 0.20
(.0035 – .0079) 0.25
REF 0.50 – 0.75
(.020 – .030) NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS …