Datasheet Analog Devices HMC606-Die — 数据表

制造商Analog Devices
系列HMC606-Die

宽带低相位噪声放大器芯片,2 - 18 GHz

数据表

Datasheet HMC606
PDF, 678 Kb, 语言: en, 文件上传: Mar 5, 2021, 页数: 7
GaAs InGaP HBT MMIC ULTRA LOW PHASE NOISE, DISTRIBUTED AMPLIFIER, 2 - 18 GHz
从文件中提取

价格

状态

HMC606HMC606-SX
Lifecycle StatusProduction (Appropriate for new designs but newer alternatives may exist)Production (Appropriate for new designs but newer alternatives may exist)

打包

HMC606HMC606-SX
N12
PackageCHIPS OR DIECHIPS OR DIE
Package CodeXX

参数化

Parameters / ModelsHMC606HMC606-SX
Device MatchInternalInternal
Freq Response RF(max), Hz18G18G
Freq Response RF(min), Hz2G2G
Gain dB(typ), dB12.512.5
Is(typ), A64m64m
NF(typ), dB6.56.5
OIP3(typ), dBm2222
OP1dB(typ), dBm1313
Operating Temperature Range, °C-55 to 85-40 to 85
Price (100-499), $ US$74.71 (HMC606)$74.71 (HMC606)
RF Primary FunctionLNA, Low Phase Noise, Wideband Distributed AmpsLNA, Low Phase Noise, Wideband Distributed Amps
Vs(typ), V55

生态计划

HMC606HMC606-SX
RoHSCompliantCompliant

模型线

系列: HMC606-Die (2)

制造商分类

  • Amplifiers > Wideband Distributed Amplifiers | Low Noise Amplifiers
  • RF & Microwave > Low Phase Noise Amplifiers