Datasheet STMicroelectronics STM32L552ME — 数据表

STM32L562xx
Ultra-low-power Arm® Cortex®-M33 32-bit MCU+TrustZone®+FPU,
165DMIPS, up to 512KB Flash, 256KB SRAM, SMPS, AES+PKA
Datasheet -production data Features
Ultra-low-power with FlexPowerControl
• 1.71 V to 3.6 V power supply UFQFPN48 (7 x 7 mm) LQFP48 (7 x 7 mm)
LQFP64 (10 x 10 mm)
LQFP100(*) (14 x14 mm)
LQFP144 (20 x 20mm) • -40 °C to 85/125 °C temperature range
• Batch acquisition mode (BAM)
• 187 nA in VBAT mode: supply for RTC and
32x32-bit backup registers
• 17 nA Shutdown mode (5 wakeup pins) FBGA UFBGA132 (7 x 7 mm) • 108 nA Standby mode (5 wakeup pins) WLCSP81 (4.36 x 4.07 mm) (*): Silhouette shown above. • 222 nA Standby mode with RTC
• 3.16 μA Stop 2 with RTC Memories • 106 μA/MHz Run mode (LDO mode) • Up to 512-Kbyte Flash, two banks read-whilewrite • 62 μA/MHz Run mode @ 3 V
(SMPS step-down converter mode)
• 5 µs wakeup from Stop mode • 256 Kbytes of SRAM including 64 Kbytes with
hardware parity check • Brownout reset (BOR) in all modes except
Shutdown • External memory interface supporting SRAM,
PSRAM, NOR, NAND and FRAM memories Core • OCTOSPI memory interface • Arm® 32-bit Cortex®-M33 CPU with
TrustZone® and FPU Security
• Arm® TrustZone® and securable I/Os,
memories and peripherals ART Accelerator
• 8-Kbyte instruction cache allowing 0-wait-state …

STM32L552xx
Ultra-low-power Arm® Cortex®-M33 32-bit MCU+TrustZone®+FPU,
165 DMIPS, up to 512 KB Flash memory, 256 KB SRAM, SMPS
Datasheet -production data Features
Ultra-low-power with FlexPowerControl
• 1.71 V to 3.6 V power supply LQFP48 (7 x 7 mm)
LQFP64 (10 x 10 mm)
LQFP100(*) (14 x14 mm)
LQFP144 (20 x 20mm) • -40 °C to 85/125 °C temperature range
• Batch acquisition mode (BAM)
• 187 nA in VBAT mode: supply for RTC and
32x32-bit backup registers
• 17 nA Shutdown mode (5 wakeup pins) FBGA UFBGA132 (7 x 7 mm) • 108 nA Standby mode (5 wakeup pins) UFQFPN48 (7 x 7 mm) WLCSP81 (4.36 x 4.07 mm) (*): Silhouette shown above. • 222 nA Standby mode with RTC
• 3.16 μA Stop 2 with RTC Memories • 106 μA/MHz Run mode (LDO mode) • Up to 512-Kbyte Flash, two banks read-whilewrite • 62 μA/MHz Run mode @ 3 V
(SMPS step-down converter mode)
• 5 µs wakeup from Stop mode • 256 Kbytes of SRAM including 64 Kbytes with
hardware parity check • Brownout reset (BOR) in all modes except
Shutdown • External memory interface supporting SRAM,
PSRAM, NOR, NAND and FRAM memories Core • OCTOSPI memory interface • Arm® 32-bit Cortex®-M33 CPU with
TrustZone® and FPU Security
• Arm® TrustZone® and securable I/Os,
memories and peripherals ART Accelerator
• 8-Kbyte instruction cache allowing 0-wait-state …