Datasheet Texas Instruments TPA3001D1PWPR — 数据表
| 制造商 | Texas Instruments |
| 系列 | TPA3001D1 |
| 零件号 | TPA3001D1PWPR |
20W单声道D类音频功率放大器（TPA3001）24-HTSSOP -40至85
数据表
价格
状态
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
打包
| Pin | 24 |
| Package Type | PWP |
| Industry STD Term | HTSSOP |
| JEDEC Code | R-PDSO-G |
| Package QTY | 2000 |
| Carrier | LARGE T&R |
| Device Marking | TPA3001D1 |
| Width (mm) | 4.4 |
| Length (mm) | 7.8 |
| Thickness (mm) | 1 |
| Pitch (mm) | .65 |
| Max Height (mm) | 1.2 |
| Mechanical Data | 下载 |
参数化
| Analog Supply (V) | 8 Max |
| Audio Input Type | Analog |
| Closed/Open Loop | Open |
| Control Interface | Hardware |
| Operating Temperature Range | -40 to 85 C |
| Package Group | HTSSOP |
| Package Size: mm2:W x L | 24HTSSOP: 50 mm2: 6.4 x 7.8(HTSSOP) PKG |
| Power Stage Supply(Max) | 18 V |
| Power Stage Supply(Min) | 8 V |
| Power to Bridge Tied Load(Max) | 20 W |
| Rating | Catalog |
| Speaker Channels | 1 Max |
| Supported Bridge Tied Load(Min) | 4 Ohms |
生态计划
| RoHS | Compliant |
应用须知
- Layout Guidelines For TPA300x Series PartsPDF, 647 Kb, 档案已发布: Jul 15, 2003
This article provides a well-reinforced procedure for the PCB layout task as it pertains to the TPA300x series of class D amplifiers. This information can also be used in the layout of the TPA200x series, or any other class D audio amplifier.This task needs a logical sequence. If we simply jump into the layout task, without understanding how the circuits work, we risk not having an optimal end - AN-1737 Managing EMI in Class D Audio Applications (Rev. A)PDF, 140 Kb, 修订版: A, 档案已发布: May 1, 2013
Electromagnetic interference (EMI) is an unwanted disturbance caused in an electrical circuit byelectromagnetic radiation emitted from an external source. The disturbance may interrupt, obstruct, orotherwise degrade the effective performance of the circuit. - Using Thermal Calculation Tools for Analog ComponentsPDF, 1.1 Mb, 档案已发布: Sep 2, 2010
This document provides general guidance on the use of toolsand calculations for thermal estimates of component operating temperatures for analog devices. Of particularfocus are components with direct thermal paths to the PCB which is common for components which need a low thermal resistance to manage the dissipated power. This document provides practical considerations for estimation of o - AN-1849 An Audio Amplifier Power Supply Design (Rev. B)PDF, 1.9 Mb, 修订版: B, 档案已发布: May 1, 2013
This application report provides design information for a power supply for use with our newest offering of high-performance, ultra high-fidelity audio amplifier input stage ICs. - Guidelines for Measuring Audio Power Amplifier PerformancePDF, 765 Kb, 档案已发布: Oct 30, 2001
This application note provides guidelines for measuring the date sheet parameters of Texas Instruments audio power amplifiers (APAs) using prefabricated evaluation modules (EVMs). The primary equipment used for the measurements consists of the System Two audio measurement system by Audio Precision , a digital multimeter (DMM), and a dc power supply.
模型线
系列: TPA3001D1 (4)
- TPA3001D1PWP TPA3001D1PWPG4 TPA3001D1PWPR TPA3001D1PWPRG4
制造商分类
- Semiconductors > Audio > Mid-Power Audio Amplifiers (10-50W) > Analog Input Amplifiers