Datasheet ES3H - Multicomp DIODE, ULTRA-FAST, 3 A, 500 V — 数据表

详细说明

Manufacturer: Multicomp

Description: DIODE, ULTRA-FAST, 3 A, 500 V

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Docket:
ES3x Series
Features:
· · · · · · · · · · Glass passivated junction chip.

For surface mounted application. Low profile package. Built-in strain relief. Ideal for automated placement. Easy pick and place. Super fast recovery time for high efficiency. Glass passivated chip junction. High temperature soldering: 260°C/10 seconds at terminals. Plastic material.
SMC/DO-214AB
Dimensions : Inches (Millimetres)

Specifications:

• Current Ifsm: 100 A
• Diode Type: Fast Recovery
• External Depth: 2.62 mm
• External Length / Height: 6.22 mm
• External Width: 7.11 mm
• Forward Current If Max: 3 A
• Forward Current If(AV): 3 A
• Forward Surge Current Ifsm Max: 100 A
• Forward Voltage VF Max: 1.7 V
• Forward Voltage: 1.7 V
• Junction Temperature Tj Max: 150°C
• Junction Temperature Tj Min: -55°C
• Junction to Case Thermal Resistance A: 47 °C/W
• Mounting Type: SMD
• Number of Pins: 2
• Operating Temperature Range: -55°C to +150°C
• Package / Case: SMC
• Repetitive Reverse Voltage Vrrm Max: 500 V
• Reverse Recovery Time trr Max: 35 ns
• SVHC: No SVHC (19-Dec-2011)

RoHS: Yes