Datasheet TL601, TL604, TL607, TL610 (Texas Instruments) - 7

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PACKAGE OPTION ADDENDUM. PACKAGING INFORMATION. Orderable Device. Status (1). Package. Pins Package Eco Plan (2). Lead/Ball Finish

PACKAGE OPTION ADDENDUM PACKAGING INFORMATION Orderable Device Status (1) Package Pins Package Eco Plan (2) Lead/Ball Finish

该数据表的模型线

TL601
TL604
TL607
TL610

文件文字版本

PACKAGE OPTION ADDENDUM
www.ti.com 30-Mar-2005
PACKAGING INFORMATION Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Type Drawing Qty
TL601CP OBSOLETE PDIP P 8 TBD Call TI Call TI TL601IP OBSOLETE PDIP P 8 TBD Call TI Call TI TL604CP OBSOLETE PDIP P 8 TBD Call TI Call TI TL607CP OBSOLETE PDIP P 8 TBD Call TI Call TI TL610CP OBSOLETE PDIP P 8 TBD Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1