Datasheet LTM8042, LTM8042-1 (Analog Devices) - 2
| 制造商 | Analog Devices |
| 描述 | μModule (Power Module) Boost LED Driver and Current Source |
| 页数 / 页 | 32 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. … |
| 文件格式/大小 | PDF / 304 Kb |
| 文件语言 | 英语 |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. PART MARKING*. TEMPERATURE RANGE. PART NUMBER
该数据表的模型线
文件文字版本
LTM8042/LTM8042-1
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
V BSTIN/BKLED– CC, RUN, PWM, TGEN, BSTIN/BKLED– ...40V BSTOUT/BKIN, LED+ ..43V TG 7 CTL, SYNC ..6V VCC BANK 2 BANK 3 BANK 4 BANK 5 6 Internal Operating Temperature BSTOUT/BKIN LED+ 5 (Notes 3, 4) ... –40°C to 125°C Maximum Reflow Body Temperature .. 245°C 4 BANK 1 Storage Temperature ... –55°C to 125°C 3 TGEN GND 2 CTL 1 A B C D E F G H J K L RUN SYNC RT SS PWM LGA PACKAGE 77-LEAD (15mm × 9mm × 2.82mm) TJMAX = 125°C, θJA = 15.7°C/W, θJCtop = 13.6°C/W, θJCbottom = 4.5°C/W, θJB = 9.4°C/W θ VALUES DETERMINED PER JESD 51-12 WEIGHT = 1.1g
ORDER INFORMATION PART MARKING* TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE PACKAGE TYPE MSL RATING (Note 4)
LTM8042EV#PBF Au (RoHS) LTM8042V e4 LGA 3 –40°C to 125°C LTM8042IV#PBF Au (RoHS) LTM8042V e4 LGA 3 –40°C to 125°C LTM8042EV-1#PBF Au (RoHS) LTM8042V-1 e4 LGA 3 –40°C to 125°C LTM8042IV-1#PBF Au (RoHS) LTM8042V-1 e4 LGA 3 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 80421fb 2 For more information www.linear.com/LTM8042
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
V BSTIN/BKLED– CC, RUN, PWM, TGEN, BSTIN/BKLED– ...40V BSTOUT/BKIN, LED+ ..43V TG 7 CTL, SYNC ..6V VCC BANK 2 BANK 3 BANK 4 BANK 5 6 Internal Operating Temperature BSTOUT/BKIN LED+ 5 (Notes 3, 4) ... –40°C to 125°C Maximum Reflow Body Temperature .. 245°C 4 BANK 1 Storage Temperature ... –55°C to 125°C 3 TGEN GND 2 CTL 1 A B C D E F G H J K L RUN SYNC RT SS PWM LGA PACKAGE 77-LEAD (15mm × 9mm × 2.82mm) TJMAX = 125°C, θJA = 15.7°C/W, θJCtop = 13.6°C/W, θJCbottom = 4.5°C/W, θJB = 9.4°C/W θ VALUES DETERMINED PER JESD 51-12 WEIGHT = 1.1g
ORDER INFORMATION PART MARKING* TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE PACKAGE TYPE MSL RATING (Note 4)
LTM8042EV#PBF Au (RoHS) LTM8042V e4 LGA 3 –40°C to 125°C LTM8042IV#PBF Au (RoHS) LTM8042V e4 LGA 3 –40°C to 125°C LTM8042EV-1#PBF Au (RoHS) LTM8042V-1 e4 LGA 3 –40°C to 125°C LTM8042IV-1#PBF Au (RoHS) LTM8042V-1 e4 LGA 3 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 80421fb 2 For more information www.linear.com/LTM8042