Datasheet CAT5113 - 4
| 描述 | 100‐tap Digital Potentiometer (POT) |
| 页数 / 页 | 13 / 4 — CAT5113. Table 1. OPERATION MODES. INC. U/D. Operation. Table 2. ABSOLUTE … |
| 文件格式/大小 | PDF / 203 Kb |
| 文件语言 | 英语 |
CAT5113. Table 1. OPERATION MODES. INC. U/D. Operation. Table 2. ABSOLUTE MAXIMUM RATINGS. Parameters. Ratings. Units
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CAT5113 Table 1. OPERATION MODES INC CS U/D Operation
High to Low Low High Wiper toward H High to Low Low Low Wiper toward L High Low to High X Store Wiper Position Low Low to High X No Store, Return to Standby X High X Standby
Table 2. ABSOLUTE MAXIMUM RATINGS Parameters Ratings Units
Supply Voltage V VCC to GND −0.5 to +7 Inputs V CS to GND −0.5 to VCC +0.5 INC to GND −0.5 to VCC +0.5 V U/D to GND −0.5 to VCC +0.5 V H to GND −0.5 to VCC +0.5 V L to GND −0.5 to VCC +0.5 V W to GND −0.5 to VCC +0.5 V Operating Ambient Temperature C Commercial (‘C’ or Blank suffix) 0 to 70 Industrial (‘I’ suffix) −40 to +85 C Junction Temperature +150 C Storage Temperature −65 to 150 C Lead Soldering (10 s max) +300 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Table 3. RELIABILITY CHARACTERISTICS Symbol Parameter Test Method Min Typ Max Units
VZAP (Note 1) ESD Susceptibility MIL−STD−883, Test Method 3015 2000 V ILTH (Notes 1, 2) Latch-Up JEDEC Standard 17 100 mA TDR Data Retention MIL−STD−883, Test Method 1008 100 Years NEND Endurance MIL−STD−883, Test Method 1003 1,000,000 Stores 1. This parameter is tested initially and after a design or process change that affects the parameter. 2. Latch-up protection is provided for stresses up to 100 mA on address and data pins from −1 V to VCC + 1 V
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CAT5113 Table 1. OPERATION MODES INC CS U/D Operation
High to Low Low High Wiper toward H High to Low Low Low Wiper toward L High Low to High X Store Wiper Position Low Low to High X No Store, Return to Standby X High X Standby
Table 2. ABSOLUTE MAXIMUM RATINGS Parameters Ratings Units
Supply Voltage V VCC to GND −0.5 to +7 Inputs V CS to GND −0.5 to VCC +0.5 INC to GND −0.5 to VCC +0.5 V U/D to GND −0.5 to VCC +0.5 V H to GND −0.5 to VCC +0.5 V L to GND −0.5 to VCC +0.5 V W to GND −0.5 to VCC +0.5 V Operating Ambient Temperature C Commercial (‘C’ or Blank suffix) 0 to 70 Industrial (‘I’ suffix) −40 to +85 C Junction Temperature +150 C Storage Temperature −65 to 150 C Lead Soldering (10 s max) +300 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Table 3. RELIABILITY CHARACTERISTICS Symbol Parameter Test Method Min Typ Max Units
VZAP (Note 1) ESD Susceptibility MIL−STD−883, Test Method 3015 2000 V ILTH (Notes 1, 2) Latch-Up JEDEC Standard 17 100 mA TDR Data Retention MIL−STD−883, Test Method 1008 100 Years NEND Endurance MIL−STD−883, Test Method 1003 1,000,000 Stores 1. This parameter is tested initially and after a design or process change that affects the parameter. 2. Latch-up protection is provided for stresses up to 100 mA on address and data pins from −1 V to VCC + 1 V
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