Datasheet XL6019 - 4
| 描述 | 180KHz 60V 5A Switching Current Boost / Buck-Boost / Inverting DC/DC Converter |
| 页数 / 页 | 13 / 4 — XL6019. 180KHz 60V 5A Switching Current Boost / Buck-Boost / Inverting … |
| 文件格式/大小 | PDF / 309 Kb |
| 文件语言 | 英语 |
XL6019. 180KHz 60V 5A Switching Current Boost / Buck-Boost / Inverting DC/DC Converter. Ordering Information
文件文字版本
XL6019 180KHz 60V 5A Switching Current Boost / Buck-Boost / Inverting DC/DC Converter Ordering Information
Order Information Marking ID Package Type Packing Type Supplied As XL6019E1 XL6019E1 TO263-5L 800 Units on Tape & Reel XLSEMI Pb-free products, as designated with “E1” suffix in the par number, are RoHS compliant.
Absolute Maximum Ratings
（
Note1
）
Parameter Symbol Value Unit
Input Voltage Vin -0.3 to 45 V Feedback Pin Voltage VFB -0.3 to Vin V EN Pin Voltage VEN -0.3 to Vin V Output Switch Pin Voltage VOutput -0.3 to 60 V Power Dissipation PD Internally limited mW Thermal Resistance (TO263-5L) R (Junction to Ambient, No Heatsink, Free Air) JA 30 ºC/W Maximum Junction Temperature TJ -40 to 150 ºC Operating Junction Temperature TJ -40 to 125 ºC Storage Temperature TSTG -65 to 150 ºC Lead Temperature (Soldering, 10 sec) TLEAD 260 ºC ESD (HBM) >2000 V
Note1:
Stresses greater than those listed under Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Rev 1.1 www.xlsemi.com 4
Order Information Marking ID Package Type Packing Type Supplied As XL6019E1 XL6019E1 TO263-5L 800 Units on Tape & Reel XLSEMI Pb-free products, as designated with “E1” suffix in the par number, are RoHS compliant.
Absolute Maximum Ratings
（
Note1
）
Parameter Symbol Value Unit
Input Voltage Vin -0.3 to 45 V Feedback Pin Voltage VFB -0.3 to Vin V EN Pin Voltage VEN -0.3 to Vin V Output Switch Pin Voltage VOutput -0.3 to 60 V Power Dissipation PD Internally limited mW Thermal Resistance (TO263-5L) R (Junction to Ambient, No Heatsink, Free Air) JA 30 ºC/W Maximum Junction Temperature TJ -40 to 150 ºC Operating Junction Temperature TJ -40 to 125 ºC Storage Temperature TSTG -65 to 150 ºC Lead Temperature (Soldering, 10 sec) TLEAD 260 ºC ESD (HBM) >2000 V
Note1:
Stresses greater than those listed under Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Rev 1.1 www.xlsemi.com 4