Datasheet LTC1041 (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | BANG-BANG Controller |
| 页数 / 页 | 8 / 8 — PACKAGE DESCRIPTIO. J8 Package. 8-Lead CERDIP (Narrow .300 Inch, … |
| 文件格式/大小 | PDF / 176 Kb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTIO. J8 Package. 8-Lead CERDIP (Narrow .300 Inch, Hermetic). OBSOLETE PACKAGE. N8 Package
该数据表的模型线
文件文字版本
LTC1041
U PACKAGE DESCRIPTIO J8 Package 8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110) CORNER LEADS OPTION .405 (4 PLCS) (10.287) .200 .005 .300 BSC MAX (5.080) (0.127) (7.62 BSC) MAX MIN .023 – .045 8 7 6 5 (0.584 – 1.143) HALF LEAD .015 – .060 OPTION (0.381 – 1.524) .025 .220 – .310 .045 – .068 (0.635) (5.588 – 7.874) (1.143 – 1.650) RAD TYP .008 – .018 FULL LEAD 0° – 15° (0.203 – 0.457) OPTION J8 0801 1 2 3 4 .045 – .065 .125 NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE (1.143 – 1.651) 3.175 OR TIN PLATE LEADS MIN .014 – .026 .100 (0.360 – 0.660) (2.54) BSC
OBSOLETE PACKAGE N8 Package 8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510) .400* (10.160) .300 – .325 .045 – .065 .130 ± .005 MAX (7.620 – 8.255) (1.143 – 1.651) (3.302 ± 0.127) 8 7 6 5 .065 .255 ± .015* (1.651) (6.477 ± 0.381) .008 – .015 TYP .120 (0.203 – 0.381) (3.048) .020 +.035 MIN (0.508) .325 1 2 3 4 –.015 MIN .100 .018 ± .003 N8 1002 +0.889 8.255 (2.54) (0.457 ± 0.076) ( ) –0.381 BSC NOTE: INCHES 1. DIMENSIONS ARE MILLIMETERS *THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610) .189 – .197 (4.801 – 5.004) NOTE 3 .045 ±.005 .010 – .020 × .050 BSC 45° .053 – .069 8 7 6 5 (0.254 – 0.508) (1.346 – 1.752) .004 – .010 N .008 – .010 0 (0.101 – 0.254) N (0.203 – 0.254) °– 8° TYP .150 – .157 .245 .228 – .244 MIN .160 ±.005 .016 – .050 (3.810 – 3.988) .014 – .019 .050 (5.791 – 6.197) (0.406 – 1.270) NOTE 3 (0.355 – 0.483) (1.270) N/2 NOTE: TYP BSC 1 2 3 N/2 INCHES 1. DIMENSIONS IN (MILLIMETERS) 2. DRAWING NOT TO SCALE .030 ±.005 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 1 2 3 4 TYP RECOMMENDED SOLDER PAD LAYOUT MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 0502 1041fa LW/TP 1202 1K REV A • PRINTED IN USA 8 Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com LINEAR TECHNOLOGY CORPORATION 1985
U PACKAGE DESCRIPTIO J8 Package 8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110) CORNER LEADS OPTION .405 (4 PLCS) (10.287) .200 .005 .300 BSC MAX (5.080) (0.127) (7.62 BSC) MAX MIN .023 – .045 8 7 6 5 (0.584 – 1.143) HALF LEAD .015 – .060 OPTION (0.381 – 1.524) .025 .220 – .310 .045 – .068 (0.635) (5.588 – 7.874) (1.143 – 1.650) RAD TYP .008 – .018 FULL LEAD 0° – 15° (0.203 – 0.457) OPTION J8 0801 1 2 3 4 .045 – .065 .125 NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE (1.143 – 1.651) 3.175 OR TIN PLATE LEADS MIN .014 – .026 .100 (0.360 – 0.660) (2.54) BSC
OBSOLETE PACKAGE N8 Package 8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510) .400* (10.160) .300 – .325 .045 – .065 .130 ± .005 MAX (7.620 – 8.255) (1.143 – 1.651) (3.302 ± 0.127) 8 7 6 5 .065 .255 ± .015* (1.651) (6.477 ± 0.381) .008 – .015 TYP .120 (0.203 – 0.381) (3.048) .020 +.035 MIN (0.508) .325 1 2 3 4 –.015 MIN .100 .018 ± .003 N8 1002 +0.889 8.255 (2.54) (0.457 ± 0.076) ( ) –0.381 BSC NOTE: INCHES 1. DIMENSIONS ARE MILLIMETERS *THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610) .189 – .197 (4.801 – 5.004) NOTE 3 .045 ±.005 .010 – .020 × .050 BSC 45° .053 – .069 8 7 6 5 (0.254 – 0.508) (1.346 – 1.752) .004 – .010 N .008 – .010 0 (0.101 – 0.254) N (0.203 – 0.254) °– 8° TYP .150 – .157 .245 .228 – .244 MIN .160 ±.005 .016 – .050 (3.810 – 3.988) .014 – .019 .050 (5.791 – 6.197) (0.406 – 1.270) NOTE 3 (0.355 – 0.483) (1.270) N/2 NOTE: TYP BSC 1 2 3 N/2 INCHES 1. DIMENSIONS IN (MILLIMETERS) 2. DRAWING NOT TO SCALE .030 ±.005 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 1 2 3 4 TYP RECOMMENDED SOLDER PAD LAYOUT MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 0502 1041fa LW/TP 1202 1K REV A • PRINTED IN USA 8 Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com LINEAR TECHNOLOGY CORPORATION 1985