Datasheet LTC6702 (Analog Devices) - 10

制造商Analog Devices
描述Tiny Micropower, Low Voltage Dual Comparators
页数 / 页12 / 10 — PACKAGE DESCRIPTION. DC Package. 8-Lead Plastic DFN (2mm. 2mm)
文件格式/大小PDF / 369 Kb
文件语言英语

PACKAGE DESCRIPTION. DC Package. 8-Lead Plastic DFN (2mm. 2mm)

PACKAGE DESCRIPTION DC Package 8-Lead Plastic DFN (2mm 2mm)

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文件文字版本

LTC6702
PACKAGE DESCRIPTION DC Package 8-Lead Plastic DFN (2mm
×
2mm)
(Reference LTC DWG # 05-08-1719 Rev A) 0.70 p0.05 2.55 p0.05 0.64 p0.05 1.15 p0.05 (2 SIDES) PACKAGE OUTLINE 0.25 p 0.05 0.45 BSC 1.37 p0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.115 TYP R = 0.05 5 8 TYP 0.40 p 0.10 2.00 p0.10 0.64 p 0.10 PIN 1 NOTCH (4 SIDES) (2 SIDES) PIN 1 BAR R = 0.20 OR TOP MARK 0.25 s 45o (SEE NOTE 6) CHAMFER (DC8) DFN 0106 REVØ 4 1 0.23 p 0.05 0.200 REF 0.75 p0.05 0.45 BSC 1.37 p0.10 (2 SIDES) 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 6702fa 10