MCP6L01/1R/1U/2/4NOTES: DS22140B-page 10 2009-2011 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC Electrical Specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Test Circuit FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 1.8V. FIGURE 2-2: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 5.5V. FIGURE 2-3: Input Offset Voltage vs. Output Voltage. FIGURE 2-4: Input Common Mode Range Voltage vs. Ambient Temperature. FIGURE 2-5: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-6: CMRR, PSRR vs. Frequency. FIGURE 2-7: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-8: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-9: Input Noise Voltage Density vs. Frequency. FIGURE 2-10: The MCP6L01/1R/1U/2/4 Show No Phase Reversal. FIGURE 2-11: Quiescent Current vs. Power Supply Voltage. FIGURE 2-12: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-13: Ratio of Output Voltage Headroom to Output Current vs. Output Current. FIGURE 2-14: Small Signal, Noninverting Pulse Response. FIGURE 2-15: Large Signal, Noninverting Pulse Response. FIGURE 2-16: Slew Rate vs. Ambient Temperature. FIGURE 2-17: Output Voltage Swing vs. Frequency. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 4.0 Application Information 4.1 Rail-to-Rail Inputs FIGURE 4-1: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-2: Output Resistor, RISO stabilizes large capacitive loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-3: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-4: Example Guard Ring Layout. 4.7 Application Circuit FIGURE 4-5: Bessel Filter. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Microchip Advanced Part Selector (MAPS) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product ID System Trademarks Worldwide Sales