Datasheet MCP6H71, MCP6H72, MCP6H74 (Microchip) - 5

link to page 5 link to page 5 link to page 5
MCP6H71/2/4 TEMPERATURE SPECIFICATIONS Electrical Characteristics:
Unless otherwise indicated, VDD = +3.5V to +12V and VSS = GND.
Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges
Operating Temperature Range TA -40 — +125 °C
Note 1
Storage Temperature Range TA -65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 8L-SOIC JA — 149.5 — °C/W Thermal Resistance, 8L-2x3 TDFN JA — 52.5 — °C/W Thermal Resistance, 14L-SOIC JA — 95.3 — °C/W Thermal Resistance, 14L-TSSOP JA — 100 — °C/W
Note 1:
The internal junction temperature (TJ) must not exceed the absolute maximum specification of +150°C.
1.2 Test Circuits
C The circuit used for most DC and AC tests is shown in F 6.8 pF Figure 1-1. This circuit can independently set VCM and VOUT (refer to Equation 1-1). Note that VCM is not the circuit’s common mode voltage ((V R P + VM)/2), and that G RF V 100 k 100 k OST includes VOS plus the effects (on the input offset error, V V V OST) of temperature, CMRR, PSRR and AOL. P DD/2 VDD VIN+
EQUATION 1-1:
C C B1 B2 G = R  R DM F G
MCP6H7X
100 nF 1 µF V = V + V  2  2 CM P DD V V = V – V IN– OST IN – IN+ V = V  2 + V – V  + V  1 + G  OUT DD P M OST DM V V M OUT Where: R R C G RF L L 100 k 100 k 10 k 60 pF GDM = Differential Mode Gain (V/V) VCM = Op Amp’s Common Mode (V) Input Voltage CF V 6.8 pF L VOST = Op Amp’s Total Input Offset (mV) Voltage
FIGURE 1-1:
AC and DC Test Circuit for Most Specifications.  2012-2014 Microchip Technology Inc. DS20002325C-page 5 Document Outline Features Applications Design Aids Description Package Types 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-5: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-6: Input Offset Voltage vs. Output Voltage. FIGURE 2-7: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-10: CMRR, PSRR vs. Frequency. FIGURE 2-11: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-12: Input Bias, Offset Currents vs. Ambient Temperature. FIGURE 2-13: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-14: Quiescent Current vs. Ambient Temperature. FIGURE 2-15: Quiescent Current vs. Power Supply Voltage. FIGURE 2-16: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-17: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-18: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-19: Channel-to-Channel Separation vs. Frequency (MCP6H72/4 only). FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-22: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-23: Output Voltage Swing vs. Frequency. FIGURE 2-24: Output Voltage Headroom vs. Output Current. FIGURE 2-25: Output Voltage Headroom vs. Output Current. FIGURE 2-26: Output Voltage Headroom vs. Output Current. FIGURE 2-27: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-28: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-29: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-30: Slew Rate vs. Ambient Temperature. FIGURE 2-31: Slew Rate vs. Ambient Temperature. FIGURE 2-32: Small Signal Non-Inverting Pulse Response. FIGURE 2-33: Small Signal Inverting Pulse Response. FIGURE 2-34: Large Signal Non-Inverting Pulse Response. FIGURE 2-35: Large Signal Inverting Pulse Response. FIGURE 2-36: The MCP6H71/2/4 Shows No Phase Reversal. FIGURE 2-37: Closed-Loop Output Impedance vs. Frequency. FIGURE 2-38: Measured Input Current vs. Input Voltage (below VSS). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 3.4 Exposed Thermal Pad (EP) 4.0 Application Information 4.1 Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.7 Application Circuits FIGURE 4-8: High-Side Current Sensing Using Difference Amplifier. FIGURE 4-9: Active Full-Wave Rectifier. FIGURE 4-10: Triangle Waves Generator. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 MAPS (Microchip Advanced Part Selector) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service