Datasheet ADA4855-3 (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | Single Supply, High Speed, Rail-to-Rail Output, Triple Op Amp |
| 页数 / 页 | 21 / 6 — Data Sheet. ADA4855-3. ABSOLUTE MAXIMUM RATINGS. MAXIMUM POWER … |
| 修订版 | A |
| 文件格式/大小 | PDF / 596 Kb |
| 文件语言 | 英语 |
Data Sheet. ADA4855-3. ABSOLUTE MAXIMUM RATINGS. MAXIMUM POWER DISSIPATION. Table 3. Parameter. Rating. 3.0. 2.5. (W N. IO T. 2.0. ISSI D. 1.5
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Data Sheet ADA4855-3 ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION Table 3. Parameter Rating
The maximum power that can be safely dissipated by the Supply Voltage 6 V ADA4855-3 is limited by the associated rise in junction Internal Power Dissipation1 See Figure 3 temperature. The maximum safe junction temperature for Common-Mode Input Voltage (−V plastic encapsulated devices is determined by the glass S − 0.2 V) to (+VS − 1 V) Differential Input Voltage ±V transition temperature of the plastic, approximately 150°C. S Output Short-Circuit Duration Observe power curves Temporarily exceeding this limit may cause a shift in parametric Storage Temperature Range −65°C to +125°C performance due to a change in the stresses exerted on the die Operating Temperature Range −40°C to +105°C by the package. Exceeding a junction temperature of 175°C for Lead Temperature (Soldering, 10 sec) 300°C an extended period can result in device failure. To ensure proper operation, it is necessary to observe the 1 Specification is for device in free air. maximum power derating curves. Stresses above those listed under Absolute Maximum Ratings
3.0
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
) 2.5
other conditions above those indicated in the operational
(W N
section of this specification is not implied. Exposure to absolute
IO T 2.0
maximum rating conditions for extended periods may affect
PA
device reliability.
ISSI D 1.5 ER THERMAL RESISTANCE W
θ
1.0 M PO
JA is specified for the worst-case conditions, that is, θJA is specified for a device soldered in a circuit board for surface-mount packages.
MU XI 0.5 MA Table 4.
103
Package Type θ 0
07685-
JA θJC Unit 0 10 20 30 40 50 60 70 80 90
16-Lead LFCSP 67 17.5 °C/W
–40 –30 –20 –10 100 AMBIENT TEMPERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
Rev. A | Page 5 of 20 Document Outline Features Applications Connection Diagram General Description Revision History Specifications 5 V Operation 3.3 V Operation Absolute Maximum Ratings Thermal Resistance Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Test Circuits Theory of Operation Applications Information Gain Configurations 20 MHz Active Low-Pass Filter RGB Video Driver Driving Multiple Video Loads PD (Power-Down) Pin Single-Supply Operation Power Supply Bypassing Layout Outline Dimensions Ordering Guide
Data Sheet ADA4855-3 ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION Table 3. Parameter Rating
The maximum power that can be safely dissipated by the Supply Voltage 6 V ADA4855-3 is limited by the associated rise in junction Internal Power Dissipation1 See Figure 3 temperature. The maximum safe junction temperature for Common-Mode Input Voltage (−V plastic encapsulated devices is determined by the glass S − 0.2 V) to (+VS − 1 V) Differential Input Voltage ±V transition temperature of the plastic, approximately 150°C. S Output Short-Circuit Duration Observe power curves Temporarily exceeding this limit may cause a shift in parametric Storage Temperature Range −65°C to +125°C performance due to a change in the stresses exerted on the die Operating Temperature Range −40°C to +105°C by the package. Exceeding a junction temperature of 175°C for Lead Temperature (Soldering, 10 sec) 300°C an extended period can result in device failure. To ensure proper operation, it is necessary to observe the 1 Specification is for device in free air. maximum power derating curves. Stresses above those listed under Absolute Maximum Ratings
3.0
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
) 2.5
other conditions above those indicated in the operational
(W N
section of this specification is not implied. Exposure to absolute
IO T 2.0
maximum rating conditions for extended periods may affect
PA
device reliability.
ISSI D 1.5 ER THERMAL RESISTANCE W
θ
1.0 M PO
JA is specified for the worst-case conditions, that is, θJA is specified for a device soldered in a circuit board for surface-mount packages.
MU XI 0.5 MA Table 4.
103
Package Type θ 0
07685-
JA θJC Unit 0 10 20 30 40 50 60 70 80 90
16-Lead LFCSP 67 17.5 °C/W
–40 –30 –20 –10 100 AMBIENT TEMPERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
Rev. A | Page 5 of 20 Document Outline Features Applications Connection Diagram General Description Revision History Specifications 5 V Operation 3.3 V Operation Absolute Maximum Ratings Thermal Resistance Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Test Circuits Theory of Operation Applications Information Gain Configurations 20 MHz Active Low-Pass Filter RGB Video Driver Driving Multiple Video Loads PD (Power-Down) Pin Single-Supply Operation Power Supply Bypassing Layout Outline Dimensions Ordering Guide