Datasheet ADA4311-1 (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | Low Cost, Dual, High Current Output Line Driver with Shutdown |
| 页数 / 页 | 17 / 6 — ADA4311-1. ABSOLUTE MAXIMUM RATINGS. Maximum Power Dissipation. Table 2. … |
| 文件格式/大小 | PDF / 304 Kb |
| 文件语言 | 英语 |
ADA4311-1. ABSOLUTE MAXIMUM RATINGS. Maximum Power Dissipation. Table 2. Parameter Rating. 5.0. THERMAL RESISTANCE. 4.5. 4.0. 3.5
文件文字版本
link to page 6
ADA4311-1 ABSOLUTE MAXIMUM RATINGS Maximum Power Dissipation Table 2.
The maximum safe power dissipation for the ADA4311-1 is
Parameter Rating
limited by the associated rise in junction temperature (TJ) on Supply Voltage 13.6 V the die. At approximately 150°C, which is the glass transition Power Dissipation (TJMAX − TA)/θJA temperature, the plastic changes its properties. Even temporarily Storage Temperature Range −65°C to +125°C exceeding this temperature limit can change the stresses that the Operating Temperature Range −40°C to +85°C package exerts on the die, permanently shifting the parametric Lead Temperature (Soldering 10 sec) 300°C performance of the amplifiers. Exceeding a junction temperature of Junction Temperature 150°C 150°C for an extended period can result in changes in silicon Stresses above those listed under Absolute Maximum Ratings devices, potentially causing degradation or loss of functionality. may cause permanent damage to the device. This is a stress rating Figure 3 shows the maximum safe power dissipation in only; functional operation of the device at these or any other the package vs. the ambient temperature for the 10-lead conditions above those indicated in the operational section of MINI_SO_EP (44°C/W) on a JEDEC standard 4-layer board. this specification is not implied. Exposure to absolute maximum θJA values are approximations. rating conditions for extended periods may affect device reliability.
5.0 THERMAL RESISTANCE 4.5 )
Thermal resistance (θ
W
JA) is specified for the worst-case conditions,
( 4.0 N
that is, θJA is specified for device soldered in circuit board for
IO 3.5
surface-mount packages.
AT MINI_SO_EP-10 IP S 3.0 S Table 3. R DI 2.5 E Package Type θJA Unit W O 2.0
10-Lead MINI_SO_EP 44 °C/W
P UM 1.5 IM X A 1.0 M 0.5 0 –35 –15 5 25 45 65 85
3 00 0-
AMBIENT TEMPERATURE (°C)
94 06 Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
Rev. 0 | Page 5 of 16 Document Outline FEATURES APPLICATIONS PIN CONFIGURATION TYPICAL APPLICATION GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Maximum Power Dissipation ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATION INFORMATION FEEDBACK RESISTOR SELECTION POWER CONTROL MODES OF OPERATION EXPOSED THERMAL PAD CONNECTIONS POWERLINE APPLICATION BOARD LAYOUT POWER SUPPLY BYPASSING OUTLINE DIMENSIONS ORDERING GUIDE
ADA4311-1 ABSOLUTE MAXIMUM RATINGS Maximum Power Dissipation Table 2.
The maximum safe power dissipation for the ADA4311-1 is
Parameter Rating
limited by the associated rise in junction temperature (TJ) on Supply Voltage 13.6 V the die. At approximately 150°C, which is the glass transition Power Dissipation (TJMAX − TA)/θJA temperature, the plastic changes its properties. Even temporarily Storage Temperature Range −65°C to +125°C exceeding this temperature limit can change the stresses that the Operating Temperature Range −40°C to +85°C package exerts on the die, permanently shifting the parametric Lead Temperature (Soldering 10 sec) 300°C performance of the amplifiers. Exceeding a junction temperature of Junction Temperature 150°C 150°C for an extended period can result in changes in silicon Stresses above those listed under Absolute Maximum Ratings devices, potentially causing degradation or loss of functionality. may cause permanent damage to the device. This is a stress rating Figure 3 shows the maximum safe power dissipation in only; functional operation of the device at these or any other the package vs. the ambient temperature for the 10-lead conditions above those indicated in the operational section of MINI_SO_EP (44°C/W) on a JEDEC standard 4-layer board. this specification is not implied. Exposure to absolute maximum θJA values are approximations. rating conditions for extended periods may affect device reliability.
5.0 THERMAL RESISTANCE 4.5 )
Thermal resistance (θ
W
JA) is specified for the worst-case conditions,
( 4.0 N
that is, θJA is specified for device soldered in circuit board for
IO 3.5
surface-mount packages.
AT MINI_SO_EP-10 IP S 3.0 S Table 3. R DI 2.5 E Package Type θJA Unit W O 2.0
10-Lead MINI_SO_EP 44 °C/W
P UM 1.5 IM X A 1.0 M 0.5 0 –35 –15 5 25 45 65 85
3 00 0-
AMBIENT TEMPERATURE (°C)
94 06 Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
Rev. 0 | Page 5 of 16 Document Outline FEATURES APPLICATIONS PIN CONFIGURATION TYPICAL APPLICATION GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Maximum Power Dissipation ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATION INFORMATION FEEDBACK RESISTOR SELECTION POWER CONTROL MODES OF OPERATION EXPOSED THERMAL PAD CONNECTIONS POWERLINE APPLICATION BOARD LAYOUT POWER SUPPLY BYPASSING OUTLINE DIMENSIONS ORDERING GUIDE