Datasheet ADA4310-1 (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | Low Cost, Dual, High Current Output Line Driver with Shutdown |
| 页数 / 页 | 15 / 6 — Data Sheet. ADA4310-1. ABSOLUTE MAXIMUM RATINGS. Table 2. Parameter … |
| 修订版 | C |
| 文件格式/大小 | PDF / 438 Kb |
| 文件语言 | 英语 |
Data Sheet. ADA4310-1. ABSOLUTE MAXIMUM RATINGS. Table 2. Parameter Rating. 5.0. 4.5. ) W. 4.0. 3.5. MINI_SO_EP-10. IP S. 3.0. R DI. 2.5. LFCSP_VQ-16
文件文字版本
link to page 6
Data Sheet ADA4310-1 ABSOLUTE MAXIMUM RATINGS Table 2.
performance of the amplifiers. Exceeding a junction temperature of
Parameter Rating
150°C for an extended period can result in changes in silicon Supply Voltage devices, potentially causing degradation or loss of functionality. 10-Lead MINI_SO_EP 12 V Figure 4 shows the maximum safe power dissipation in the 16-Lead LFCSP ±6V package vs. the ambient temperature for the 10-lead MINI_SO_EP Power Dissipation (T JMAX − TA)/θJA (44°C/W) and for the 16-lead LFCSP (63°C/W) on a JEDEC Storage Temperature Range −65°C to +125°C standard 4-layer board. θJA values are approximations. Operating Temperature Range −40°C to +85°C Lead Temperature (Soldering 10 sec) 300°C
5.0
Junction Temperature 150°C
4.5 ) W
Stresses at or above those listed under Absolute Maximum
( 4.0 N
Ratings may cause permanent damage to the product. This is a
IO 3.5 AT MINI_SO_EP-10
stress rating only; functional operation of the product at these
IP S 3.0 S
or any other conditions above those indicated in the operational
R DI 2.5
section of this specification is not implied. Operation beyond
E LFCSP_VQ-16 W 2.0
the maximum operating conditions for extended periods may
O P
affect product reliability.
UM 1.5 IM X A 1.0 THERMAL RESISTANCE M 0.5
θJA is specified for the worst-case conditions, that is, θJA is
0
6 specified for device soldered in circuit board for surface-mount
–35 –15 5 25 45 65 85
01 7- packages.
AMBIENT TEMPERATURE (°C)
02 06 Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
Table 3. Package Type θJA Unit ESD CAUTION
10-Lead MINI_SO_EP 44 °C/W 16-Lead LFCSP 63 °C/W
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4310-1 is limited by the associated rise in junction temperature (TJ) on the die. At approximately 150C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit can change the stresses that the package exerts on the die, permanently shifting the parametric Rev. B | Page 5 of 14 Document Outline FEATURES APPLICATIONS PIN CONFIGURATIONS GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Maximum Power Dissipation ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATION INFORMATION FEEDBACK RESISTOR SELECTION POWER CONTROL MODES OF OPERATION EXPOSED THERMAL PAD CONNECTIONS POWER LINE APPLICATION BOARD LAYOUT POWER SUPPLY BYPASSING OUTLINE DIMENSIONS ORDERING GUIDE
Data Sheet ADA4310-1 ABSOLUTE MAXIMUM RATINGS Table 2.
performance of the amplifiers. Exceeding a junction temperature of
Parameter Rating
150°C for an extended period can result in changes in silicon Supply Voltage devices, potentially causing degradation or loss of functionality. 10-Lead MINI_SO_EP 12 V Figure 4 shows the maximum safe power dissipation in the 16-Lead LFCSP ±6V package vs. the ambient temperature for the 10-lead MINI_SO_EP Power Dissipation (T JMAX − TA)/θJA (44°C/W) and for the 16-lead LFCSP (63°C/W) on a JEDEC Storage Temperature Range −65°C to +125°C standard 4-layer board. θJA values are approximations. Operating Temperature Range −40°C to +85°C Lead Temperature (Soldering 10 sec) 300°C
5.0
Junction Temperature 150°C
4.5 ) W
Stresses at or above those listed under Absolute Maximum
( 4.0 N
Ratings may cause permanent damage to the product. This is a
IO 3.5 AT MINI_SO_EP-10
stress rating only; functional operation of the product at these
IP S 3.0 S
or any other conditions above those indicated in the operational
R DI 2.5
section of this specification is not implied. Operation beyond
E LFCSP_VQ-16 W 2.0
the maximum operating conditions for extended periods may
O P
affect product reliability.
UM 1.5 IM X A 1.0 THERMAL RESISTANCE M 0.5
θJA is specified for the worst-case conditions, that is, θJA is
0
6 specified for device soldered in circuit board for surface-mount
–35 –15 5 25 45 65 85
01 7- packages.
AMBIENT TEMPERATURE (°C)
02 06 Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
Table 3. Package Type θJA Unit ESD CAUTION
10-Lead MINI_SO_EP 44 °C/W 16-Lead LFCSP 63 °C/W
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4310-1 is limited by the associated rise in junction temperature (TJ) on the die. At approximately 150C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit can change the stresses that the package exerts on the die, permanently shifting the parametric Rev. B | Page 5 of 14 Document Outline FEATURES APPLICATIONS PIN CONFIGURATIONS GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Maximum Power Dissipation ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATION INFORMATION FEEDBACK RESISTOR SELECTION POWER CONTROL MODES OF OPERATION EXPOSED THERMAL PAD CONNECTIONS POWER LINE APPLICATION BOARD LAYOUT POWER SUPPLY BYPASSING OUTLINE DIMENSIONS ORDERING GUIDE