Datasheet AD8661, AD8662, AD8664 (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | 16 V Precision, CMOS Rail-to-Rail Quad Op Amp |
| 页数 / 页 | 16 / 7 — Data Sheet. AD8661/AD8662/AD8664. ABSOLUTE MAXIMUM RATINGS Table 5. … |
| 修订版 | E |
| 文件格式/大小 | PDF / 577 Kb |
| 文件语言 | 英语 |
Data Sheet. AD8661/AD8662/AD8664. ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE. Parameter. Rating
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Data Sheet AD8661/AD8662/AD8664 ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Supply Voltage 18 V soldered in a circuit board for surface-mount packages. Input Voltage −0.1 V to V S Differential Input Voltage 18 V
Table 6. Thermal Resistance
Output Short-Circuit Duration to GND Indefinite
Package Type θ θ Unit JA JC
Storage Temperature Range −60°C to +150°C 8-Lead SOIC 121 43 °C/W Operating Temperature Range 8-Lead LFCSP 751 181 °C/W R-8, RM-8, R-14, and RU-14 −40°C to +125°C 8-Lead MSOP 142 44 °C/W CP-8-13 −40°C to +85°C 14-Lead SOIC 88.2 56.3 °C/W Junction Temperature Range −65°C to +150°C 14-Lead TSSOP 114 23.3 °C/W Lead Temperature, Soldering (60 sec) 300°C 1 Exposed pad soldered to application board. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
ESD CAUTION
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. E | Page 7 of 16 Document Outline FEATURES APPLICATIONS PIN CONFIGURATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS AD8661/AD8662/AD8664 ELECTRICAL CHARACTERISTICS—SOIC, MSOP, AND TSSOP AD8661/AD8662/AD8664 ELECTRICAL CHARACTERISTICS—SOIC, MSOP, AND TSSOP AD8661 ELECTRICAL CHARACTERISTICS—LFCSP ONLY AD8661 ELECTRICAL CHARACTERISTICS—LFCSP ONLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE NOTES
Data Sheet AD8661/AD8662/AD8664 ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Supply Voltage 18 V soldered in a circuit board for surface-mount packages. Input Voltage −0.1 V to V S Differential Input Voltage 18 V
Table 6. Thermal Resistance
Output Short-Circuit Duration to GND Indefinite
Package Type θ θ Unit JA JC
Storage Temperature Range −60°C to +150°C 8-Lead SOIC 121 43 °C/W Operating Temperature Range 8-Lead LFCSP 751 181 °C/W R-8, RM-8, R-14, and RU-14 −40°C to +125°C 8-Lead MSOP 142 44 °C/W CP-8-13 −40°C to +85°C 14-Lead SOIC 88.2 56.3 °C/W Junction Temperature Range −65°C to +150°C 14-Lead TSSOP 114 23.3 °C/W Lead Temperature, Soldering (60 sec) 300°C 1 Exposed pad soldered to application board. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
ESD CAUTION
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. E | Page 7 of 16 Document Outline FEATURES APPLICATIONS PIN CONFIGURATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS AD8661/AD8662/AD8664 ELECTRICAL CHARACTERISTICS—SOIC, MSOP, AND TSSOP AD8661/AD8662/AD8664 ELECTRICAL CHARACTERISTICS—SOIC, MSOP, AND TSSOP AD8661 ELECTRICAL CHARACTERISTICS—LFCSP ONLY AD8661 ELECTRICAL CHARACTERISTICS—LFCSP ONLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE NOTES