Datasheet ADA4862-3 (Analog Devices) - 6

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ADA4862-3 ABSOLUTE MAXIMUM RATINGS Table 3.
The power dissipated in the package (PD) is the sum of the
Parameter Rating
quiescent power dissipation and the power dissipated in the die due Supply Voltage 12.6 V to the amplifier’s drive at the output. The quiescent power is the Power Dissipation See Figure 3 voltage between the supply pins (VS) × the quiescent current (IS). Common-Mode Input Voltage ±VS Storage Temperature −65°C to +125°C PD = Quiescent Power + (Total Drive Power − Load Power) Operating Temperature Range −40°C to +105°C ⎛ V V ⎞ V 2 Lead Temperature JEDEC J-STD-20 = × + ⎜ × ⎟ D P ( S V IS ) S OUT OUT – ⎝ 2 R ⎠ R Junction Temperature 150°C L L Stresses above those listed under Absolute Maximum Ratings RMS output voltages should be considered. may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any Airflow increases heat dissipation, effectively reducing θJA. other conditions above those indicated in the operational In addition, more metal directly in contact with the package section of this specification is not implied. Exposure to absolute leads and through holes under the device reduces θJA. maximum rating conditions for extended periods may affect Figure 3 shows the maximum safe power dissipation in the device reliability. package vs. the ambient temperature for the 14-lead SOIC
THERMAL RESISTANCE
(90°C/W) on a JEDEC standard 4-layer board. θJA values are approximations. θJA is specified for the worst-case conditions, that is, θJA is specified for device soldered in circuit board for surface-mount
2.5
packages.
) W Table 4. Thermal Resistance ( 2.0 Package Type θJA Unit TION
14-lead SOIC 90 °C/W
1.5 ISSIPA D R Maximum Power Dissipation E 1.0
The maximum safe power dissipation for the ADA4862-3 is
POW M U
limited by the associated rise in junction temperature (TJ) on
XIM 0.5
the die. At approximately 150°C, which is the glass transition
A M
temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit may change the
0
05600-036
–55 –45 –35 –25 –15 –5 5 15 25 35 45 55 65 75 85 95 105 115 125
stresses that the package exerts on the die, permanently shifting
AMBIENT TEMPERATURE (
°
C)
the parametric performance of the amplifiers. Exceeding a Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board junction temperature of 150°C for an extended period can result in changes in silicon devices, potentially causing degradation or loss of functionality.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. A | Page 5 of 16 Document Outline FEATURES APPLICATIONS PIN CONFIGURATION GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Maximum Power Dissipation ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS USING THE ADA4862-3 IN GAINS = +1, −1 Unity-Gain Operation (Option 1) Option 2 VIDEO LINE DRIVER SINGLE-SUPPLY OPERATION POWER DOWN LAYOUT CONSIDERATIONS POWER SUPPLY BYPASSING OUTLINE DIMENSIONS ORDERING GUIDE