Datasheet ADA4851-1, ADA4851-2, ADA4851-4 (Analog Devices) - 10

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ADA4851-1/ADA4851-2/ADA4851-4 ABSOLUTE MAXIMUM RATINGS
PD = Quiescent Power + (Total Drive Power − Load Power)
Table 4. Parameter Rating
⎛ V V ⎞ V 2 = × + ⎜ × ⎟ D P ( – S V IS ) S OUT OUT Supply Voltage 12.6 V ⎝ 2 RL ⎠ RL Power Dissipation See Figure 5 RMS output voltages should be considered. If R Common-Mode Input Voltage −V L is referenced S − 0.5 V to +VS + 0.5 V to −V Differential Input Voltage +V S, as in single-supply operation, the total drive power is S to −VS V Storage Temperature Range −65°C to +125°C S × IOUT. If the rms signal levels are indeterminate, consider the worst case, when V Operating Temperature Range −40°C to +125°C OUT = VS/4 for RL to midsupply. Lead Temperature JEDEC J-STD-20 V 2 /4 = × + D P ( S V IS ) ( S ) Junction Temperature 150°C RL Stresses above those listed under Absolute Maximum Ratings In single-supply operation with RL referenced to −VS, the worst may cause permanent damage to the device. This is a stress case is VOUT = VS/2. rating only; functional operation of the device at these or any Airflow increases heat dissipation, effectively reducing θJA. other conditions above those indicated in the operational In addition, more metal directly in contact with the package section of this specification is not implied. Exposure to absolute leads and through holes under the device reduces θJA. maximum rating conditions for extended periods may affect device reliability. Figure 5 shows the maximum safe power dissipation in the package vs. the ambient temperature for the 6-lead SOT-23
THERMAL RESISTANCE
(170°C/W), the 8-lead MSOP (150°C/W), and the 14-lead θJA is specified for the worst-case conditions; that is, θJA is specified TSSOP (120°C/W) on a JEDEC standard 4-layer board. θJA for device soldered in circuit board for surface-mount packages. values are approximations.
2.0 Table 5. Thermal Resistance Package Type θJA Unit ) TSSOP
6-lead SOT-23 170 °C/W
(W N 1.5 IO
8-lead MSOP 150 °C/W
PAT
14-lead TSSOP 120 °C/W
MSOP SSI R DI 1.0 E Maximum Power Dissipation W
The maximum safe power dissipation for the ADA4851-1/
SOT-23-6
ADA4851-2/ADA4851-4 is limited by the associated rise in
MUM PO 0.5
junction temperature (TJ) on the die. At approximately 150°C,
MAXI
which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit
0 –55 –45 –35 –25 –15 –5 5 15 25 35 45 55 65 75 85 95 105 115 125
may change the stresses that the package exerts on the die,
AMBIENT TEMPERATURE (
°
C)
05143-057 permanently shifting the parametric performance of the amplifiers. Exceeding a junction temperature of 150°C for an Figure 5. Maximum Power Dissipation vs. Temperature for a 4-Layer Board extended period can result in changes in silicon devices, potentially causing degradation or loss of functionality.
ESD CAUTION
The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the die due to the drive of the amplifier at the output. The quiescent power is the voltage between the supply pins (VS) times the quiescent current (IS). Rev. J | Page 10 of 24 Document Outline FEATURES APPLICATIONS PIN CONFIGURATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS SPECIFICATIONS WITH +3 V SUPPLY SPECIFICATIONS WITH +5 V SUPPLY SPECIFICATIONS WITH ±5 V SUPPLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Maximum Power Dissipation ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS CIRCUIT DESCRIPTION HEADROOM CONSIDERATIONS OVERLOAD BEHAVIOR AND RECOVERY Input Output SINGLE-SUPPLY VIDEO AMPLIFIER VIDEO RECONSTRUCTION FILTER OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS