link to page 4 AD8565/AD8566/AD8567ABSOLUTE MAXIMUM RATINGS Table 2.THERMAL RESISTANCEParameterRating θJA is specified for worst-case conditions, that is, for a device Supply Voltage (VS) 18 V soldered onto a circuit board for surface-mount packages. Input Voltage −0.5 V to VS + 0.5 V Table 3. Thermal Resistance Differential Input Voltage VS Package Typeθ Storage Temperature Range −65°C to +150°C JAθJCUnit 5-Lead SC70 (KS-5) 376 126 °C/W Operating Temperature Range −40°C to +85°C 8-Lead MSOP (RM-8) 210 45 °C/W Junction Temperature Range −65°C to +150°C 14-Lead TSSOP (RU-14) 180 35 °C/W Lead Temperature (Soldering, 60 sec) 300°C 16-Lead LFCSP (CP-16-4) 381 301 °C/W Stresses above those listed under Absolute Maximum Ratings 1 DAP is soldered down to PCB. may cause permanent damage to the device. This is a stress ESD CAUTION rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. G | Page 4 of 16 Document Outline Features Applications General Description Pin Configurations Revision History Specifications Electrical Characteristics Absolute Maximum Ratings Thermal Resistance ESD Caution Typical Performance Characteristics Theory of Operation Input Overvoltage Protection Output Phase Reversal Power Dissipation Thermal Pad—AD8567 Total Harmonic Distortion + Noise (THD + N) Short-Circuit Output Conditions LCD Panel Applications Outline Dimensions Ordering Guide