Datasheet AD8042 (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | Dual 160 MHz Rail-to-Rail Amplifier |
| 页数 / 页 | 18 / 8 — AD8042. ABSOLUTE MAXIMUM RATINGS. Table 4. Parameter Rating. 2.0. 8-LEAD … |
| 修订版 | E |
| 文件格式/大小 | PDF / 363 Kb |
| 文件语言 | 英语 |
AD8042. ABSOLUTE MAXIMUM RATINGS. Table 4. Parameter Rating. 2.0. 8-LEAD PLASTIC-DIP PACKAGE. ) W. N (. 1.5. TJ = 150°C. S IS. D R. 1.0. W O
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AD8042 ABSOLUTE MAXIMUM RATINGS Table 4.
Exceeding a junction temperature of 175°C for an extended
Parameter Rating
period can result in device failure. Supply Voltage 12.6 V Internal Power Dissipation1 While the AD8042 is internally short-circuit protected, this 8-Lead PDIP (N) 1.3 W may not be sufficient to guarantee that the maximum junction 8-Lead SOIC_N (R) 0.9 W temperature (150°C) is not exceeded under all conditions. To Input Voltage (Common Mode) ±V ensure proper operation, it is necessary to observe the S ± 0.5 V Differential Input Voltage ±3.4 V maximum power derating curves. Output Short-Circuit Duration Observe Power
2.0
Derating Curves
8-LEAD PLASTIC-DIP PACKAGE
Storage Temperature Range (N, R) −65°C to +125°C
) W
Lead Temperature (Soldering, 10 sec) 300°C
N ( 1.5 IO
1 Specification is for the device in free air:
AT TJ = 150°C IP
8-Lead PDIP: θJA = 90°C/W
S IS
8-Lead SOIC_N: θJA = 155°C/W.
D R 1.0 E
Stresses above those listed under Absolute Maximum Ratings
W O
may cause permanent damage to the device. This is a stress
P 8-LEAD SOIC PACKAGE UM
rating only; functional operation of the device at these or any
0.5 IM
other conditions above those indicated in the operational
AX M
4 section of this specification is not implied. Exposure to absolute -00 59 maximum rating conditions for extended periods may affect
0
010
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
device reliability.
AMBIENT TEMPERATURE (°C)
Figure 4. Maximum Power Dissipation vs. Temperature
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
ESD CAUTION
AD8042 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150°C. Exceeding this limit temporarily can cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Rev. E | Page 6 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION CONNECTION DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION CIRCUIT DESCRIPTION DRIVING CAPACITIVE LOADS OVERDRIVE RECOVERY Single-Supply Composite Video Line Driver Single-Ended-to-Differential Driver Single-Supply Differential A/D Driver HDSL Line Driver LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE
AD8042 ABSOLUTE MAXIMUM RATINGS Table 4.
Exceeding a junction temperature of 175°C for an extended
Parameter Rating
period can result in device failure. Supply Voltage 12.6 V Internal Power Dissipation1 While the AD8042 is internally short-circuit protected, this 8-Lead PDIP (N) 1.3 W may not be sufficient to guarantee that the maximum junction 8-Lead SOIC_N (R) 0.9 W temperature (150°C) is not exceeded under all conditions. To Input Voltage (Common Mode) ±V ensure proper operation, it is necessary to observe the S ± 0.5 V Differential Input Voltage ±3.4 V maximum power derating curves. Output Short-Circuit Duration Observe Power
2.0
Derating Curves
8-LEAD PLASTIC-DIP PACKAGE
Storage Temperature Range (N, R) −65°C to +125°C
) W
Lead Temperature (Soldering, 10 sec) 300°C
N ( 1.5 IO
1 Specification is for the device in free air:
AT TJ = 150°C IP
8-Lead PDIP: θJA = 90°C/W
S IS
8-Lead SOIC_N: θJA = 155°C/W.
D R 1.0 E
Stresses above those listed under Absolute Maximum Ratings
W O
may cause permanent damage to the device. This is a stress
P 8-LEAD SOIC PACKAGE UM
rating only; functional operation of the device at these or any
0.5 IM
other conditions above those indicated in the operational
AX M
4 section of this specification is not implied. Exposure to absolute -00 59 maximum rating conditions for extended periods may affect
0
010
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
device reliability.
AMBIENT TEMPERATURE (°C)
Figure 4. Maximum Power Dissipation vs. Temperature
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
ESD CAUTION
AD8042 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150°C. Exceeding this limit temporarily can cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Rev. E | Page 6 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION CONNECTION DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION CIRCUIT DESCRIPTION DRIVING CAPACITIVE LOADS OVERDRIVE RECOVERY Single-Supply Composite Video Line Driver Single-Ended-to-Differential Driver Single-Supply Differential A/D Driver HDSL Line Driver LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE