Datasheet AD820 (Analog Devices) - 10
| 制造商 | Analog Devices |
| 描述 | Single-Supply, Rail-to-Rail, Low Power FET-Input Op Amp |
| 页数 / 页 | 25 / 10 — AD820. ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE. Parameter. … |
| 修订版 | H |
| 文件格式/大小 | PDF / 415 Kb |
| 文件语言 | 英语 |
AD820. ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE. Parameter. Rating. Table 5. Thermal Resistance. Package Type. Unit
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AD820 ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Supply Voltage ±18 V soldered in a circuit board for surface-mount packages. Internal Power Dissipation
Table 5. Thermal Resistance
8-Lead PDIP (N) 1.6 W
Package Type θ Unit
8-Lead SOIC_N (R) 1.0 W
JA
8-Lead MSOP (RM) 0.8 W 8-Lead PDIP (N) 90 °C/W Input Voltage1 ((V+) + 0.2 V) to 8-Lead SOIC_N (R) 160 °C/W (V−) − 20 V 8-Lead MSOP (RM) 190 °C/W Output Short-Circuit Duration Indefinite Differential Input Voltage ±30 V Stresses above those listed under Absolute Maximum Ratings Storage Temperature Range may cause permanent damage to the device. This is a stress 8-Lead PDIP (N) −65°C to +125°C rating only; functional operation of the device at these or any 8-Lead SOIC_N (R) −65°C to +150°C other conditions above those indicated in the operational 8-Lead MSOP (RM) −65°C to +150°C section of this specification is not implied. Exposure to absolute Operating Temperature Range maximum rating conditions for extended periods may affect AD820A/AD820B −40°C to +85°C device reliability. Lead Temperature(Soldering, 60 sec) 260°C 1 See Input Characteristics section.
ESD CAUTION
Rev. H | Page 9 of 24 Document Outline Features Applications Pin Configurations General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Typical Performance Characteristics Applications Information Input Characteristics Output Characteristics Single-Supply Half-Wave and Full-Wave Rectifiers 4.5 V Low Dropout, Low Power Reference Low Power, 3-Pole, Sallen Key Low-Pass Filter Offset Voltage Adjustment Outline Dimensions Ordering Guide
AD820 ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Supply Voltage ±18 V soldered in a circuit board for surface-mount packages. Internal Power Dissipation
Table 5. Thermal Resistance
8-Lead PDIP (N) 1.6 W
Package Type θ Unit
8-Lead SOIC_N (R) 1.0 W
JA
8-Lead MSOP (RM) 0.8 W 8-Lead PDIP (N) 90 °C/W Input Voltage1 ((V+) + 0.2 V) to 8-Lead SOIC_N (R) 160 °C/W (V−) − 20 V 8-Lead MSOP (RM) 190 °C/W Output Short-Circuit Duration Indefinite Differential Input Voltage ±30 V Stresses above those listed under Absolute Maximum Ratings Storage Temperature Range may cause permanent damage to the device. This is a stress 8-Lead PDIP (N) −65°C to +125°C rating only; functional operation of the device at these or any 8-Lead SOIC_N (R) −65°C to +150°C other conditions above those indicated in the operational 8-Lead MSOP (RM) −65°C to +150°C section of this specification is not implied. Exposure to absolute Operating Temperature Range maximum rating conditions for extended periods may affect AD820A/AD820B −40°C to +85°C device reliability. Lead Temperature(Soldering, 60 sec) 260°C 1 See Input Characteristics section.
ESD CAUTION
Rev. H | Page 9 of 24 Document Outline Features Applications Pin Configurations General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Typical Performance Characteristics Applications Information Input Characteristics Output Characteristics Single-Supply Half-Wave and Full-Wave Rectifiers 4.5 V Low Dropout, Low Power Reference Low Power, 3-Pole, Sallen Key Low-Pass Filter Offset Voltage Adjustment Outline Dimensions Ordering Guide