Datasheet LTC3130, LTC3130-1 (Analog Devices) - 36
| 制造商 | Analog Devices |
| 描述 | 25V, 600mA Buck-Boost DC/DC Converter with 1.6µA Quiescent Current |
| 页数 / 页 | 38 / 36 — PACKAGE DESCRIPTION. Please refer to … |
| 文件格式/大小 | PDF / 1.9 Mb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTION. Please refer to http://www.linear.com/product/LTC3130#packaging. for the most recent package drawings
该数据表的模型线
- LTC3130EMSE#PBF LTC3130EMSE#PBF LTC3130EMSE#TRPBF LTC3130EMSE#TRPBF LTC3130EMSE-1#PBF LTC3130EMSE-1#PBF LTC3130EMSE-1#TRPBF LTC3130EMSE-1#TRPBF LTC3130EUDC#PBF LTC3130EUDC#PBF LTC3130EUDC#TRPBF LTC3130EUDC#TRPBF LTC3130EUDC-1#PBF LTC3130EUDC-1#PBF LTC3130EUDC-1#TRPBF LTC3130EUDC-1#TRPBF LTC3130IMSE#PBF LTC3130IMSE#PBF LTC3130IMSE#TRPBF LTC3130IMSE#TRPBF LTC3130IMSE-1#PBF LTC3130IMSE-1#PBF LTC3130IMSE-1#TRPBF LTC3130IMSE-1#TRPBF LTC3130IUDC#PBF LTC3130IUDC#PBF LTC3130IUDC#TRPBF LTC3130IUDC#TRPBF LTC3130IUDC-1#PBF LTC3130IUDC-1#PBF LTC3130IUDC-1#TRPBF LTC3130IUDC-1#TRPBF
文件文字版本
LTC3130/LTC3130-1
PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LTC3130#packaging for the most recent package drawings. UDC Package 20-Lead Plastic QFN (3mm
×
4mm)
(Reference LTC DWG # 05-08-1742 Rev Ø) 0.70 ±0.05 3.50 ±0.05 2.10 ±0.05 2.65 ±0.05 1.50 REF 1.65 ±0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC 2.50 REF 3.10 ±0.05 4.50 ±0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED PIN 1 NOTCH 0.75 ±0.05 R = 0.20 OR 0.25 3.00 ±0.10 1.50 REF × 45° CHAMFER R = 0.05 TYP 19 20 0.40 ±0.10 PIN 1 1 TOP MARK 2 (NOTE 6) 2.65 ±0.10 4.00 ±0.10 2.50 REF 1.65 ±0.10 (UDC20) QFN 1106 REV Ø 0.200 REF R = 0.115 0.25 ±0.05 0.00 – 0.05 TYP 0.50 BSC BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 3130f 36 For more information www.linear.com/LTC3130 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Typical Performance Characteristics Pin Functions LTC3130 Block Diagram LTC3130-1 Block Diagram Operation Applications Information Package Description Typical Application Related Parts
PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LTC3130#packaging for the most recent package drawings. UDC Package 20-Lead Plastic QFN (3mm
×
4mm)
(Reference LTC DWG # 05-08-1742 Rev Ø) 0.70 ±0.05 3.50 ±0.05 2.10 ±0.05 2.65 ±0.05 1.50 REF 1.65 ±0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC 2.50 REF 3.10 ±0.05 4.50 ±0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED PIN 1 NOTCH 0.75 ±0.05 R = 0.20 OR 0.25 3.00 ±0.10 1.50 REF × 45° CHAMFER R = 0.05 TYP 19 20 0.40 ±0.10 PIN 1 1 TOP MARK 2 (NOTE 6) 2.65 ±0.10 4.00 ±0.10 2.50 REF 1.65 ±0.10 (UDC20) QFN 1106 REV Ø 0.200 REF R = 0.115 0.25 ±0.05 0.00 – 0.05 TYP 0.50 BSC BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 3130f 36 For more information www.linear.com/LTC3130 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Typical Performance Characteristics Pin Functions LTC3130 Block Diagram LTC3130-1 Block Diagram Operation Applications Information Package Description Typical Application Related Parts