Datasheet AD5686, AD5684 (Analog Devices) - 4

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AD5686/AD5684 Data Sheet A Grade1 B Grade1 Parameter Min Typ Max Min Typ Max Unit Test Conditions/Comments
LOGIC INPUTS3 Input Current ±2 ±2 µA Per pin Input Low Voltage (VINL) 0.3 × VLOGIC 0.3 × VLOGIC V Input High Voltage (VINH) 0.7 × VLOGIC 0.7 × VLOGIC V Pin Capacitance 2 2 pF LOGIC OUTPUTS (SDO)3 Output Low Voltage, VOL 0.4 0.4 V ISINK = 200 μA Output High Voltage, VOH VLOGIC − 0.4 VLOGIC − 0.4 V ISOURCE = 200 μA Floating State Output 4 4 pF Capacitance POWER REQUIREMENTS VLOGIC 1.62 5.5 1.62 5.5 V ILOGIC 3 3 µA VDD 2.7 5.5 2.7 5.5 V Gain = 1 VREF + 1.5 5.5 VREF + 1.5 5.5 V Gain = 2 IDD VIH = VDD, VIL = GND, VDD = 2.7 V to 5.5 V Normal Mode7 0.59 0.7 0.59 0.7 mA All Power-Down Modes8 1 4 1 4 µA −40°C to +85°C 6 6 µA −40°C to +105°C 1 Temperature range, A and B grade: −40°C to +105°C. 2 DC specifications tested with the outputs unloaded, unless otherwise noted. Upper dead band = 10 mV and exists only when VREF = VDD with gain = 1 or when VREF/2 = VDD with gain = 2. Linearity calculated using a reduced code range of 256 to 65,280 (AD5686) or 12 to 4080 (AD5684). 3 Guaranteed by design and characterization; not production tested. 4 Channel A and Channel B can have a combined output current of up to 30 mA. Similarly, Channel C and Channel D can have a combined output current of up to 30 mA up to a junction temperature of 110°C. 5 VDD = 5 V. The device includes current limiting that is intended to protect the device during temporary overload conditions. Junction temperature can be exceeded during current limit. Operation above the specified maximum operation junction temperature may impair device reliability. 6 When drawing a load current at either rail, the output voltage headroom with respect to that rail is limited by the 25 Ω typical channel resistance of the output devices. For example, when sinking 1 mA, the minimum output voltage = 25 Ω × 1 mA = 25 mV (see Figure 23). 7 Interface inactive. All DACs active. DAC outputs unloaded. 8 All DACs powered down. Rev. C | Page 4 of 27 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS AC CHARACTERISTICS TIMING CHARACTERISTICS DAISY-CHAIN AND READBACK TIMING CHARACTERISTICS Circuit and Timing Diagrams ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY THEORY OF OPERATION DIGITAL-TO-ANALOG CONVERTER TRANSFER FUNCTION DAC ARCHITECTURE Output Amplifiers SERIAL INTERFACE Input Shift Register STANDALONE OPERATION WRITE AND UPDATE COMMANDS Write to Input Register n (Dependent on LDACB) Update DAC Register n with Contents of Input Register n Write to and Update DAC Channel n (Independent of LDACB) DAISY-CHAIN OPERATION READBACK OPERATION POWER-DOWN OPERATION LOAD DAC (HARDWARE LDACB PIN) Instantaneous DAC Updating (LDACB Held Low) Deferred DAC Updating (LDACB Is Pulsed Low) LDACB MASK REGISTER HARDWARE RESET (RESETB) RESET SELECT PIN (RSTSEL) APPLICATIONS INFORMATION MICROPROCESSOR INTERFACING AD5686/AD5684 TO ADSP-BF531 INTERFACE AD5686/AD5684 TO SPORT INTERFACE LAYOUT GUIDELINES GALVANICALLY ISOLATED INTERFACE OUTLINE DIMENSIONS ORDERING GUIDE