Datasheet ADL5567 (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | 4.3 GHz, Ultrahigh Dynamic Range, Dual Differential Amplifier |
| 页数 / 页 | 25 / 8 — ADL5567. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table … |
| 修订版 | A |
| 文件格式/大小 | PDF / 869 Kb |
| 文件语言 | 英语 |
ADL5567. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 2. Parameter. Rating. Table 3. Thermal Resistance
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ADL5567 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating
Thermal performance is directly linked to printed circuit board Output Voltage Swing × Bandwidth Product (PCB) design and operating environment. High Performance Mode 5 V-GHz Careful attention to PCB thermal design is required. Low Power Mode 3 V-GHz Supply Voltage (V
Table 3. Thermal Resistance
S) at VCC1, VCC2 5.25 V
1 2
VIPx, VINx V
Package Type θJA θJC Unit
S + 0.5 V ±I CP-24-19 56 2.2 °C/W OUT Maximum (VIPx and VINx Pins) ±30 mA Internal Power Dissipation 900 mW 1 Measured on Analog Devices evaluation board. Maximum Junction Temperature 135°C 2 Based on simulation with JEDEC standard JESD51. Operating Temperature Range −40°C to +85°C
ESD CAUTION
Storage Temperature Range −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 6 of 23 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BASIC CONNECTIONS INPUT AND OUTPUT INTERFACING Single-Ended Input to Differential Output INPUT AND OUTPUT EQUIVALENT CIRCUITS GAIN ADJUSTMENT AND INTERFACING EFFECT OF LOAD CAPACITANCE ADC INTERFACING SOLDERING INFORMATION AND RECOMMENDED LAND PATTERN EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE
Thermal performance is directly linked to printed circuit board Output Voltage Swing × Bandwidth Product (PCB) design and operating environment. High Performance Mode 5 V-GHz Careful attention to PCB thermal design is required. Low Power Mode 3 V-GHz Supply Voltage (V
Table 3. Thermal Resistance
S) at VCC1, VCC2 5.25 V
1 2
VIPx, VINx V
Package Type θJA θJC Unit
S + 0.5 V ±I CP-24-19 56 2.2 °C/W OUT Maximum (VIPx and VINx Pins) ±30 mA Internal Power Dissipation 900 mW 1 Measured on Analog Devices evaluation board. Maximum Junction Temperature 135°C 2 Based on simulation with JEDEC standard JESD51. Operating Temperature Range −40°C to +85°C
ESD CAUTION
Storage Temperature Range −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 6 of 23 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BASIC CONNECTIONS INPUT AND OUTPUT INTERFACING Single-Ended Input to Differential Output INPUT AND OUTPUT EQUIVALENT CIRCUITS GAIN ADJUSTMENT AND INTERFACING EFFECT OF LOAD CAPACITANCE ADC INTERFACING SOLDERING INFORMATION AND RECOMMENDED LAND PATTERN EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE