Datasheet ADA4960-1 (Analog Devices) - 8

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ADA4960-1 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2.
The power dissipated in the package (PD) is the sum of the
Parameter Rating
quiescent power dissipation and the power dissipated in the package due to the load drive. The quiescent power is the voltage Supply Voltage, VCC 5.25 V between the supply pins (V VIP, VIN VCC + 0.5 V S) times the quiescent current (IS). The power dissipated due to the load drive depends upon the Internal Power Dissipation See Figure 3 particular application. The power due to load drive is calculated Maximum Junction Temperature 150°C by multiplying the load current by the associated voltage drop Operating Temperature Range −40°C to +85°C across the device. RMS voltages and currents must be used in Storage Temperature Range −65°C to +150°C these calculations. Stresses above those listed under Absolute Maximum Ratings Airflow increases heat dissipation, effectively reducing θJA. In may cause permanent damage to the device. This is a stress addition, more metal directly in contact with the package leads/ rating only; functional operation of the device at these or any exposed pad from metal traces, through holes, ground, and power other conditions above those indicated in the operational planes reduce θJA. section of this specification is not implied. Exposure to absolute Figure 3 shows the maximum safe power dissipation of the maximum rating conditions for extended periods may affect ADA4960-1 vs. the ambient temperature on a JEDEC standard device reliability. 4-layer board.
THERMAL RESISTANCE 2.5
θJA is specified for the device (including the exposed pad) soldered to a high thermal conductivity, 4-layer circuit board, as described
N 2.0
in EIA/JESD 51-7.
IO T PA Table 3. Thermal Resistance ISSI 1.5 D Package Type θ Unit JA ER W
16-Lead LFCSP (Exposed Pad) 89.5 °C/W
1.0 M PO MU MAXIMUM POWER DISSIPATION XI 0.5 MA
The maximum safe power dissipation in the ADA4960-1 package
QUIESCENT POWER
is limited by the associated rise in junction temperature (TJ) on
0
the die. At approximately 150°C, which is the glass transition
–40 –20 0 20 40 60 80 100
002 temperature, the plastic changes its properties. Even temporarily
AMBIENT TEMPERATURE (°C)
08458- exceeding this temperature limit can change the stresses that the Figure 3. Maximum Power Dissipation vs. Ambient Temperature for 4-Layer Board package exerts on the die, permanently shifting the parametric performance of the ADA4960-1. Exceeding a junction
ESD CAUTION
temperature of 150°C for an extended period can result in changes in the silicon devices, potentially causing failure. Rev. A | Page 6 of 19 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Test Circuits Circuit Description Basic Structure Applications Information Basic Connections Input and Output Interfacing Gain Adjust Bandwidth Extension ADC Interfacing Line Driver Applications Overdrive and Recovery Layout, Grounding, and Bypassing Outline Dimensions Ordering Guide