ADA4937-1/ADA4937-2Data SheetPIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS1SSSSB1S1S1UTN1ID1–V–V–V–V+–F–V–VP–O16151413242322212019–IN1 118 +OUT1–FB 112 PD+FB1 217 VOCM1+IN 2ADA4937-111 –OUT+V3ADA4937-216S1–VS2TOP VIEWTOP VIEW–IN 310 +OUT+V15 –V(Not to Scale)4S1S2(Not to Scale)–FB2 514+FB 49VPD2OCM+IN2 613 –OUT25678789SSSS101112+V+V+V+V2N2B2S2S2T2NOTESFCM–I++V+VO1. EXPOSED PADDLE. THE EXPOSED PAD IS NOTVOU +ELECTRICALLY CONNECTED TO THE DEVICE. IT IS 005 NOTESTYPICALLY SOLDERED TO GROUND OR A POWER1. EXPOSED PADDLE. THE EXPOSED PAD IS NOTPLANE ON THE PCB THAT IS THERMALLY CONDUCTIVE. 06591- ELECTRICALLY CONNECTED TO THE DEVICE. IT IS 006 TYPICALLY SOLDERED TO GROUND OR A POWERPLANE ON THE PCB THAT IS THERMALLY CONDUCTIVE. 06591- Figure 5. ADA4937-1 Pin Configuration Figure 6. ADA4937-2 Pin Configuration Table 7. ADA4937-1 Pin Function DescriptionsTable 8. ADA4937-2 Pin Function DescriptionsPin No.Mnemonic DescriptionPin No.MnemonicDescription 1 −FB Negative Output for Feedback 1 −IN1 Negative Input Summing Node 1. Component Connection. 2 +FB1 Positive Output Feedback Pin 1. 2 +IN Positive Input Summing Node. 3, 4 +V 3 −IN Negative Input Summing Node. S1 Positive Supply Voltage 1. 5 −FB2 Negative Output Feedback Pin 2. 4 +FB Positive Output for Feedback Component Connection. 6 +IN2 Positive Input Summing Node 2. 5 to 8 +V 7 −IN2 Negative Input Summing Node 2. S Positive Supply Voltage. 9 V 8 +FB2 Positive Output Feedback Pin 2. OCM Output Common-Mode Voltage. 10 +OUT Positive Output for Load Connection. 9, 10 +VS2 Positive Supply Voltage 2. 11 −OUT Negative Output for Load Connection. 11 VOCM2 Output Common-Mode Voltage 2. 12 PD 12 +OUT2 Positive Output 2. Power-Down Pin. 13 −OUT2 Negative Output 2. 13 to 16 −VS Negative Supply Voltage. 14 EP Exposed Paddle. The exposed pad is not PD2 Power-Down Pin 2. electrical y connected to the device. It is 15, 16 −VS2 Negative Supply Voltage 2. typically soldered to ground or a power 17 VOCM1 Output Common-Mode Voltage 1. plane on the PCB that is thermally 18 +OUT1 Positive Output 1. conductive. 19 −OUT1 Negative Output 1. 20 PD1 Power-Down Pin 1. 21, 22 −VS1 Negative Supply Voltage 1. 23 −FB1 Negative Output Feedback Pin 1. 24 +IN1 Positive Input Summing Node 1. EP Exposed Paddle. The exposed pad is not electrical y connected to the device. It is typically soldered to ground or a power plane on the PCB that is thermal y conductive. Rev. F | Page 8 of 28 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAMS REVISION HISTORY SPECIFICATIONS 5 V OPERATION ±DIN to ±OUT Performance VOCM to ±OUT Performance 3.3 V OPERATION ±DIN to ±OUT Performance VOCM to ±OUT Performance ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Maximum Power Dissipation ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY THEORY OF OPERATION ANALYZING AN APPLICATION CIRCUIT SETTING THE CLOSED-LOOP GAIN ESTIMATING THE OUTPUT NOISE VOLTAGE IMPACT OF MISMATCHES IN THE FEEDBACK NETWORKS CALCULATING THE INPUT IMPEDANCE FOR AN APPLICATION CIRCUIT Terminating a Single-Ended Input INPUT COMMON-MODE VOLTAGE RANGE IN SINGLE-SUPPLY APPLICATIONS SETTING THE OUTPUT COMMON-MODE VOLTAGE POWER-DOWN OPERATION LAYOUT, GROUNDING, AND BYPASSING HIGH PERFORMANCE ADC DRIVING 3.3 V OPERATION OUTLINE DIMENSIONS ORDERING GUIDE