Datasheet AMP01 (Analog Devices) - 3

1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 Flat pack V GDIP1-T18 or CDIP2-T18 18 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage (VS) ... ±18 V dc Power dissipation (PD) .. 500 mW 2/ Common mode input voltage .. Supply voltage Differential input voltage: RG ≥ 2 kΩ .. ±20 V dc RG < 2 kΩ .. ±10 V dc Output short circuit duration .. Indefinite Storage temperature range ... -65°C to +150°C Lead temperature (soldering, 60 seconds) .. +300°C Thermal resistance, junction-to-case (θJC) ... See MIL-STD-1835 Thermal resistance, junction-to-ambient (θJA): Case V ... 120°C/W Case 3 .. 104°C/W Case K ... 69°C/W 1.4 Recommended operating conditions. Supply voltage (VS) ... ±15 V dc Ambient operating temperature range (TA) ... -55°C to +125°C ______ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Must withstand the added PD due to short circuit test, e.g., IOS.
STANDARD
SIZE
5962-88630 MICROCIRCUIT DRAWING A
DLA LAND AND MARITIME REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990
G 3
DSCC FORM 2234 APR 97 Document Outline DEPARTMENT OF DEFENSE SPECIFICATION DEPARTMENT OF DEFENSE STANDARDS