Datasheet ADA4870-KGD (Analog Devices) - 8

ADA4870-KGD Known Good Die OUTLINE DIMENSIONS 2.965 0.000254 1.825 A TOP VIEW SIDE VIEW (CIRCUIT SIDE) 0.072 × 0.072 2014- 19- 09-
Figure 3. 26-Pad Bare Die [CHIP] (C-26-1) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit
Scribe Line Width 75 µm Die Size 2965 (x) × 1825 (y) µm Thickness 10 mils Backside Ti 1000 Å, Ni 3000 Å, Au 1000 Å (Au outermost) Not applicable Passivation 5 µm Polyimide on top of 1 µm Oxynitride Not applicable Bond Pads (Minimum) 72 × 72 µm Bond Pad Composition AlCu (0.5%) % ESD Human Body Model (HBM) 4 kV Field-Induced Charged Device Model (FICDM) 1.25 kV
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach Cookson D591-3B sintered Ag conductive Minimum Bond Line Thickness 1.0 mils minimum Bonding Sequence Unspecified
ORDERING GUIDE Model Temperature Range Package Description Package Option
ADA4870-KGD-DF −40°C to +85°C 26-Pad Bare Die [CHIP] C-26-1 ADA4870-KGD-WP −40°C to +85°C 26-Pad Bare Die [CHIP] C-26-1
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Rev. 0 | Page 8 of 8 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±20 V SUPPLY ±5 V SUPPLY ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE