Datasheet ADA4800-KGD (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | Low Power, High Speed CCD Buffer Amplifier |
| 页数 / 页 | 7 / 7 — Known Good Die. ADA4800-KGD. OUTLINE DIMENSIONS. 0.5250. 0.4826. 0.4600. … |
| 文件格式/大小 | PDF / 206 Kb |
| 文件语言 | 英语 |
Known Good Die. ADA4800-KGD. OUTLINE DIMENSIONS. 0.5250. 0.4826. 0.4600. TOP VIEW. SIDE VIEW. (CIRCUIT SIDE). 2017-. 0.059 × 0.059. 10- 04-
该数据表的模型线
文件文字版本
Known Good Die ADA4800-KGD OUTLINE DIMENSIONS 0.5250 0.4826 1 6 2 0.4600 5 3 4 TOP VIEW SIDE VIEW (CIRCUIT SIDE) A 2017- 0.059 × 0.059 10- 04-
Figure 4. 6-Pad Bare Die [CHIP] (C-6-11) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit
Scribe Line Width 75 μm Die Size (Maximum Size) 525 × 460 μm Thickness 482.6 μm Bond Pads (Minimum Size) 59 × 59 μm Bond Pad Composition AlCu (0.5%) % Backside None Not applicable Passivation Doped oxide/SiN Not applicable ESD, Human Body Model (HBM) 2000 V
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach Hitachi EN4900GC Bonding Method 0.8 mil gold Bonding Sequence 1, 2, 3, 4, 5, 6
ORDERING GUIDE Model Temperature Range Package Description Package Option
ADA4800-KGD-WP −40°C to +85°C 6-Pad Bare Die [CHIP] C-6-11
©2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D15621-0-4/17(0)
Rev. 0 | Page 7 of 7 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS BUFFER ELECTRICAL CHARACTERISTICS ACTIVE CURRENT LOAD ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TEST CIRCUIT OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
Figure 4. 6-Pad Bare Die [CHIP] (C-6-11) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit
Scribe Line Width 75 μm Die Size (Maximum Size) 525 × 460 μm Thickness 482.6 μm Bond Pads (Minimum Size) 59 × 59 μm Bond Pad Composition AlCu (0.5%) % Backside None Not applicable Passivation Doped oxide/SiN Not applicable ESD, Human Body Model (HBM) 2000 V
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach Hitachi EN4900GC Bonding Method 0.8 mil gold Bonding Sequence 1, 2, 3, 4, 5, 6
ORDERING GUIDE Model Temperature Range Package Description Package Option
ADA4800-KGD-WP −40°C to +85°C 6-Pad Bare Die [CHIP] C-6-11
©2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D15621-0-4/17(0)
Rev. 0 | Page 7 of 7 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS BUFFER ELECTRICAL CHARACTERISTICS ACTIVE CURRENT LOAD ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TEST CIRCUIT OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE