Datasheet MCP6V61, MCP6V61U, MCP6V62, MCP6V64 (Microchip) - 6

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MCP6V61/1U/2/4 1.3 Timing Diagrams 1.4 Test Circuits
The circuits used for most DC and AC tests are shown in Figures 1-4 and 1-5. Lay the bypass capacitors out 1.8V to 5.5V V 1.8V 0V as discussed in
Section 4.3.10 “Supply Bypassing
DD
and Filtering”
. RN is equal to the parallel combination tSTR 1.001(V of R DD/3) F and RG to minimize bias current effects. VOUT 0.999(VDD/3) VDD 1 µF R
FIGURE 1-1:
Amplifier Start-Up. V N IN R + ISO VOUT
MCP6V6X
- VIN CL RL 100 nF V t DD/3 STL VOS + 100 µV V R L V G RF OS VOS – 100 µV
FIGURE 1-4:
AC and DC Test Circuit for Most Non-Inverting Gain Conditions.
FIGURE 1-2:
Offset Correction Settling Time. VDD 1 µF R V V N IN DD/3 R + ISO VOUT
MCP6V6X
t - ODR CL RL 100 nF V V IN DD V t L ODR RG RF VOUT V
FIGURE 1-5:
AC and DC Test Circuit for DD/2 Most Inverting Gain Conditions. VSS The circuit in Figure 1-6 tests the input’s dynamic
FIGURE 1-3:
Output Overdrive Recovery. behavior (i.e., IMD, tSTR, tSTL and tODR). The potentiometer balances the resistor network (VOUT should equal VREF at DC). The op amp’s Common Mode Input Voltage is VCM = VIN/2. The error at the input (VERR) appears at VOUT with a noise gain of 10 V/V. 11.0 kΩ 100 kΩ 500Ω 0.1% 0.1% 25 turn VREF = VDD/3 VDD RISO 1 µF 0Ω VOUT VIN 100 nF CL RL
MCP6V6X
30 pF open VL 11.0 kΩ 100 kΩ 249Ω 0.1% 0.1% 1%
FIGURE 1-6:
Test Circuit for Dynamic Input Behavior. DS20005367B-page 6  2014-2015 Microchip Technology Inc. Document Outline Features Typical Applications Design Aids Related Parts General Description Package Types Typical Application Circuit FIGURE 1: Input Offset Voltage vs. Ambient Temperature with VDD = 1.8V. FIGURE 2: Input Offset Voltage vs. Ambient Temperature with VDD = 5.5V. 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC Electrical Specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Timing Diagrams FIGURE 1-1: Amplifier Start-Up. FIGURE 1-2: Offset Correction Settling Time. FIGURE 1-3: Output Overdrive Recovery. 1.4 Test Circuits FIGURE 1-4: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. FIGURE 1-5: AC and DC Test Circuit for Most Inverting Gain Conditions. FIGURE 1-6: Test Circuit for Dynamic Input Behavior. 2.0 Typical Performance Curves 2.1 DC Input Precision FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage Quadratic Temp. Co. FIGURE 2-4: Input Offset Voltage vs. Power Supply Voltage with VCM = VCML. FIGURE 2-5: Input Offset Voltage vs. Power Supply Voltage with VCM = VCMH. FIGURE 2-6: Input Offset Voltage vs. Output Voltage with VDD = 1.8V. FIGURE 2-7: Input Offset Voltage vs. Output Voltage with VDD = 5.5V. FIGURE 2-8: Input Offset Voltage vs. Common Mode Voltage with VDD = 1.8V. FIGURE 2-9: Input Offset Voltage vs. Common Mode Voltage with VDD = 5.5V. FIGURE 2-10: Common Mode Rejection Ratio. FIGURE 2-11: Power Supply Rejection Ratio. FIGURE 2-12: DC Open-Loop Gain. FIGURE 2-13: CMRR and PSRR vs. Ambient Temperature. FIGURE 2-14: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-15: Input Bias and Offset Currents vs. Common Mode Input Voltage with TA = +85°C. FIGURE 2-16: Input Bias and Offset Currents vs. Common Mode Input Voltage with TA = +125°C. FIGURE 2-17: Input Bias and Offset Currents vs. Ambient Temperature with VDD = 5.5V. FIGURE 2-18: Input Bias Current vs. Input Voltage (Below VSS). 2.2 Other DC Voltages and Currents FIGURE 2-19: Input Common Mode Voltage Headroom (Range) vs. Ambient Temperature. FIGURE 2-20: Output Voltage Headroom vs. Output Current. FIGURE 2-21: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-22: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-23: Supply Current vs. Power Supply Voltage. FIGURE 2-24: Power-On Reset Trip Voltage. FIGURE 2-25: Power-On Reset Voltage vs. Ambient Temperature. 2.3 Frequency Response FIGURE 2-26: CMRR and PSRR vs. Frequency. FIGURE 2-27: Open-Loop Gain vs. Frequency with VDD = 1.8V. FIGURE 2-28: Open-Loop Gain vs. Frequency with VDD = 5.5V. FIGURE 2-29: Gain Bandwidth Product and Phase Margin vs. Ambient Temperature. FIGURE 2-30: Gain Bandwidth Product and Phase Margin vs. Common Mode Input Voltage. FIGURE 2-31: Gain Bandwidth Product and Phase Margin vs. Output Voltage. FIGURE 2-32: Closed-Loop Output Impedance vs. Frequency with VDD = 1.8V. FIGURE 2-33: Closed-Loop Output Impedance vs. Frequency with VDD = 5.5V. FIGURE 2-34: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-35: EMIRR vs. Frequency. FIGURE 2-36: EMIRR vs. Input Voltage. FIGURE 2-37: Channel-to-Channel Separation vs. Frequency. 2.4 Input Noise and Distortion FIGURE 2-38: Input Noise Voltage Density and Integrated Input Noise Voltage vs. Frequency. FIGURE 2-39: Input Noise Voltage Density vs. Input Common Mode Voltage. FIGURE 2-40: Intermodulation Distortion vs. Frequency with VCM Disturbance (see Figure 1-6). FIGURE 2-41: Inter-Modulation Distortion vs. Frequency with VDD Disturbance (see Figure 1-6). FIGURE 2-42: Input Noise vs. Time with 1 Hz and 10 Hz Filters and VDD = 1.8V. FIGURE 2-43: Input Noise vs. Time with 1 Hz and 10 Hz Filters and VDD = 5.5V. 2.5 Time Response FIGURE 2-44: Input Offset Voltage vs. Time with Temperature Change. FIGURE 2-45: Input Offset Voltage vs. Time at Power-Up. FIGURE 2-46: The MCP6V61/1U/2/4 Family Shows No Input Phase Reversal with Overdrive. FIGURE 2-47: Non-Inverting Small Signal Step Response. FIGURE 2-48: Non-Inverting Large Signal Step Response. FIGURE 2-49: Inverting Small Signal Step Response. FIGURE 2-50: Inverting Large Signal Step Response. FIGURE 2-51: Slew Rate vs. Ambient Temperature. FIGURE 2-52: Output Overdrive Recovery vs. Time with G = -10 V/V. FIGURE 2-53: Output Overdrive Recovery Time vs. Inverting Gain. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 3.4 Exposed Thermal Pad (EP) 4.0 Applications 4.1 Overview of Zero-Drift Operation FIGURE 4-1: Simplified Zero-Drift Op Amp Functional Diagram. 4.1.1 Building Blocks 4.1.2 Chopping Action FIGURE 4-2: First Chopping Clock Phase; Equivalent Amplifier Diagram. FIGURE 4-3: Second Chopping Clock Phase; Equivalent Amplifier Diagram. 4.1.3 Intermodulation Distortion (IMD) 4.2 Other Functional Blocks 4.2.1 Rail-to-Rail Inputs FIGURE 4-4: Simplified Analog Input ESD Structures. FIGURE 4-5: Protecting the Analog Inputs Against High Voltages. FIGURE 4-6: Protecting the Analog Inputs Against High Currents. 4.2.2 Rail-to-Rail Output 4.3 Application Tips 4.3.1 Input Offset Voltage Over Temperature 4.3.2 DC Gain Plots 4.3.3 Offset at Power-Up 4.3.4 Source Resistances 4.3.5 Source Capacitance 4.3.6 Capacitive Loads FIGURE 4-7: Output Resistor, RISO, Stabilizes Capacitive Loads. FIGURE 4-8: Recommended RISO values for Capacitive Loads. 4.3.7 Stabilizing Output Loads FIGURE 4-9: Output Load. 4.3.8 Gain Peaking FIGURE 4-10: Amplifier with Parasitic Capacitance. 4.3.9 Reducing Undesired Noise and Signals 4.3.10 Supply Bypassing and Filtering 4.3.11 PCB Design for DC Precision 4.4 Typical Applications 4.4.1 Wheatstone Bridge FIGURE 4-11: Simple Design. 4.4.2 RTD Sensor FIGURE 4-12: RTD Sensor. 4.4.3 Offset Voltage Correction FIGURE 4-13: Offset Correction. 4.4.4 Precision Comparator FIGURE 4-14: Precision Comparator. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Microchip Advanced Part Selector (MAPS) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information 80 µA, 1 MHz Zero-Drift Op Amps Appendix A: Revision History Revision B (September 2015) Revision A (December 2014) Product Identification System AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Worldwide Sales and Service