Datasheet MCP3202 (Microchip) - 5
| 制造商 | Microchip |
| 描述 | 2.7V Dual Channel 12-Bit A/D Converter with SPI Serial Interface |
| 页数 / 页 | 34 / 5 — MCP3202. FIGURE 1-2: |
| 文件格式/大小 | PDF / 1.3 Mb |
| 文件语言 | 英语 |
MCP3202. FIGURE 1-2:
该数据表的模型线
文件文字版本
MCP3202
Load Circuit for tDIS and tEN Load Circuit for tR, tF, tDO Test Point 1.4V VDD tDIS Waveform 2 3 kΩ VDD/2 3 kΩ Test Point DOUT tEN Waveform DOUT 100 pF tDIS Waveform 1 C V L = 100 pF SS Voltage Waveforms for tEN Voltage Waveforms for tR, tF CS VOH V 1 2 3 OL 4 DOUT CLK tR tF D B11 OUT tEN Voltage Waveforms for tDIS Voltage Waveforms for tDO V CS IH CLK DOUT 90% tDO Waveform 1* TDIS DOUT DOUT 10% Waveform 2† * Waveform 1 is for an output with internal conditions such that the output is high, unless disabled by the output control. † Waveform 2 is for an output with internal conditions such that the output is low, unless disabled by the output control.
FIGURE 1-2:
Test Circuits. 1999-2011 Microchip Technology Inc. DS21034F-page 5 Document Outline MCP3202 - 2.7V Dual Channel 12-Bit A/D Converter with SPI Serial Interface Functional Block Diagram Package Types 1.0 Electrical Characteristics Absolute Maximum Ratings † FIGURE 1-1: Serial Timing. FIGURE 1-2: Test Circuits. 2.0 Typical Performance Characteristics FIGURE 2-1: Integral Nonlinearity (INL) vs. Sample Rate. FIGURE 2-2: Integral Nonlinearity (INL) vs. VDD. FIGURE 2-3: Integral Nonlinearity (INL) vs. Code (Representative Part). FIGURE 2-4: Integral Nonlinearity (INL) vs. Sample Rate (VDD = 2.7V). FIGURE 2-5: Integral Nonlinearity (INL) vs. VDD. FIGURE 2-6: Integral Nonlinearity (INL) vs. Code (Representative Part, VDD = 2.7V). FIGURE 2-7: Integral Nonlinearity (INL) vs. Temperature. FIGURE 2-8: Differential Nonlinearity (DNL) vs. Sample Rate. FIGURE 2-9: Differential Nonlinearity (DNL) vs. VDD. FIGURE 2-10: Integral Nonlinearity (INL) vs. Temperature (VDD = 2.7V). FIGURE 2-11: Differential Nonlinearity (DNL) vs. Sample Rate (VDD = 2.7V). FIGURE 2-12: Differential Nonlinearity (DNL) vs. VDD. FIGURE 2-13: Differential Nonlinearity (DNL) vs. Code (Representative Part). FIGURE 2-14: Differential Nonlinearity (DNL) vs. Temperature. FIGURE 2-15: Gain Error vs. VDD. FIGURE 2-16: Differential Nonlinearity (DNL) vs. Code (Representative Part, VDD = 2.7V). FIGURE 2-17: Differential Nonlinearity (DNL) vs. Temperature (VDD = 2.7V). FIGURE 2-18: Offset Error vs. VDD. FIGURE 2-19: Gain Error vs. Temperature. FIGURE 2-20: Signal-to-Noise Ratio (SNR) vs. Input Frequency. FIGURE 2-21: Total Harmonic Distortion (THD) vs. Input Frequency. FIGURE 2-22: Offset Error vs. Temperature. FIGURE 2-23: Signal-to-Noise and Distortion (SINAD) vs. Input Frequency. FIGURE 2-24: Signal-to-Noise and Distortion (SINAD) vs. Signal Level. FIGURE 2-25: Effective Number of Bits (ENOB) vs. VDD. FIGURE 2-26: Spurious Free Dynamic Range (SFDR) vs. Input Frequency. FIGURE 2-27: Frequency Spectrum of 10 kHz input (Representative Part). FIGURE 2-28: Effective Number of Bits (ENOB) vs. Input Frequency. FIGURE 2-29: Power Supply Rejection (PSR) vs. Ripple Frequency. FIGURE 2-30: Frequency Spectrum of 1 kHz input (Representative Part, VDD = 2.7V). FIGURE 2-31: IDD vs. VDD. FIGURE 2-32: IDD vs. Clock Frequency. FIGURE 2-33: IDD vs. Temperature. FIGURE 2-34: IDDS vs. VDD. FIGURE 2-35: IDDS vs. Temperature. FIGURE 2-36: Analog Input leakage current vs. Temperature. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Inputs (CH0/CH1) 3.2 Chip Select/Shutdown (CS/SHDN) 3.3 Serial Clock (CLK) 3.4 Serial Data Input (DIN) 3.5 Serial Data Output (DOUT) 4.0 Device Operation 4.1 Analog Inputs 4.2 Digital Output Code EQUATION 4-1: FIGURE 4-1: Analog Input Model. FIGURE 4-2: Maximum Clock Frequency vs. Input Resistance (RS) to maintain less than a 0.1 LSB deviation in INL from nominal conditions. 5.0 Serial Communications 5.1 Overview TABLE 5-1: Configuration Bits for the MCP3202 FIGURE 5-1: Communication with the MCP3202 using MSB first format only. FIGURE 5-2: Communication with MCP3202 using LSB first format. 6.0 Applications Information 6.1 Using the MCP3202 with Microcontroller (MCU) SPI Ports FIGURE 6-1: SPI Communication using 8-bit segments (Mode 0,0: SCLK idles low). FIGURE 6-2: SPI Communication using 8-bit segments (Mode 1,1: SCLK idles high). 6.2 Maintaining Minimum Clock Speed 6.3 Buffering/Filtering the Analog Inputs FIGURE 6-3: The MCP601 Operational Amplifier is used to implement a 2nd order anti- aliasing filter for the signal being converted by the MCP3202. 6.4 Layout Considerations FIGURE 6-4: VDD traces arranged in a ‘Star’ configuration in order to reduce errors caused by current return paths. 7.0 Packaging Information 7.1 Package Marking Information Appendix A: Revision History Worldwide Sales and Service
Load Circuit for tDIS and tEN Load Circuit for tR, tF, tDO Test Point 1.4V VDD tDIS Waveform 2 3 kΩ VDD/2 3 kΩ Test Point DOUT tEN Waveform DOUT 100 pF tDIS Waveform 1 C V L = 100 pF SS Voltage Waveforms for tEN Voltage Waveforms for tR, tF CS VOH V 1 2 3 OL 4 DOUT CLK tR tF D B11 OUT tEN Voltage Waveforms for tDIS Voltage Waveforms for tDO V CS IH CLK DOUT 90% tDO Waveform 1* TDIS DOUT DOUT 10% Waveform 2† * Waveform 1 is for an output with internal conditions such that the output is high, unless disabled by the output control. † Waveform 2 is for an output with internal conditions such that the output is low, unless disabled by the output control.
FIGURE 1-2:
Test Circuits. 1999-2011 Microchip Technology Inc. DS21034F-page 5 Document Outline MCP3202 - 2.7V Dual Channel 12-Bit A/D Converter with SPI Serial Interface Functional Block Diagram Package Types 1.0 Electrical Characteristics Absolute Maximum Ratings † FIGURE 1-1: Serial Timing. FIGURE 1-2: Test Circuits. 2.0 Typical Performance Characteristics FIGURE 2-1: Integral Nonlinearity (INL) vs. Sample Rate. FIGURE 2-2: Integral Nonlinearity (INL) vs. VDD. FIGURE 2-3: Integral Nonlinearity (INL) vs. Code (Representative Part). FIGURE 2-4: Integral Nonlinearity (INL) vs. Sample Rate (VDD = 2.7V). FIGURE 2-5: Integral Nonlinearity (INL) vs. VDD. FIGURE 2-6: Integral Nonlinearity (INL) vs. Code (Representative Part, VDD = 2.7V). FIGURE 2-7: Integral Nonlinearity (INL) vs. Temperature. FIGURE 2-8: Differential Nonlinearity (DNL) vs. Sample Rate. FIGURE 2-9: Differential Nonlinearity (DNL) vs. VDD. FIGURE 2-10: Integral Nonlinearity (INL) vs. Temperature (VDD = 2.7V). FIGURE 2-11: Differential Nonlinearity (DNL) vs. Sample Rate (VDD = 2.7V). FIGURE 2-12: Differential Nonlinearity (DNL) vs. VDD. FIGURE 2-13: Differential Nonlinearity (DNL) vs. Code (Representative Part). FIGURE 2-14: Differential Nonlinearity (DNL) vs. Temperature. FIGURE 2-15: Gain Error vs. VDD. FIGURE 2-16: Differential Nonlinearity (DNL) vs. Code (Representative Part, VDD = 2.7V). FIGURE 2-17: Differential Nonlinearity (DNL) vs. Temperature (VDD = 2.7V). FIGURE 2-18: Offset Error vs. VDD. FIGURE 2-19: Gain Error vs. Temperature. FIGURE 2-20: Signal-to-Noise Ratio (SNR) vs. Input Frequency. FIGURE 2-21: Total Harmonic Distortion (THD) vs. Input Frequency. FIGURE 2-22: Offset Error vs. Temperature. FIGURE 2-23: Signal-to-Noise and Distortion (SINAD) vs. Input Frequency. FIGURE 2-24: Signal-to-Noise and Distortion (SINAD) vs. Signal Level. FIGURE 2-25: Effective Number of Bits (ENOB) vs. VDD. FIGURE 2-26: Spurious Free Dynamic Range (SFDR) vs. Input Frequency. FIGURE 2-27: Frequency Spectrum of 10 kHz input (Representative Part). FIGURE 2-28: Effective Number of Bits (ENOB) vs. Input Frequency. FIGURE 2-29: Power Supply Rejection (PSR) vs. Ripple Frequency. FIGURE 2-30: Frequency Spectrum of 1 kHz input (Representative Part, VDD = 2.7V). FIGURE 2-31: IDD vs. VDD. FIGURE 2-32: IDD vs. Clock Frequency. FIGURE 2-33: IDD vs. Temperature. FIGURE 2-34: IDDS vs. VDD. FIGURE 2-35: IDDS vs. Temperature. FIGURE 2-36: Analog Input leakage current vs. Temperature. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Inputs (CH0/CH1) 3.2 Chip Select/Shutdown (CS/SHDN) 3.3 Serial Clock (CLK) 3.4 Serial Data Input (DIN) 3.5 Serial Data Output (DOUT) 4.0 Device Operation 4.1 Analog Inputs 4.2 Digital Output Code EQUATION 4-1: FIGURE 4-1: Analog Input Model. FIGURE 4-2: Maximum Clock Frequency vs. Input Resistance (RS) to maintain less than a 0.1 LSB deviation in INL from nominal conditions. 5.0 Serial Communications 5.1 Overview TABLE 5-1: Configuration Bits for the MCP3202 FIGURE 5-1: Communication with the MCP3202 using MSB first format only. FIGURE 5-2: Communication with MCP3202 using LSB first format. 6.0 Applications Information 6.1 Using the MCP3202 with Microcontroller (MCU) SPI Ports FIGURE 6-1: SPI Communication using 8-bit segments (Mode 0,0: SCLK idles low). FIGURE 6-2: SPI Communication using 8-bit segments (Mode 1,1: SCLK idles high). 6.2 Maintaining Minimum Clock Speed 6.3 Buffering/Filtering the Analog Inputs FIGURE 6-3: The MCP601 Operational Amplifier is used to implement a 2nd order anti- aliasing filter for the signal being converted by the MCP3202. 6.4 Layout Considerations FIGURE 6-4: VDD traces arranged in a ‘Star’ configuration in order to reduce errors caused by current return paths. 7.0 Packaging Information 7.1 Package Marking Information Appendix A: Revision History Worldwide Sales and Service