Datasheet MCP3202 (Microchip) - 10

制造商Microchip
描述2.7V Dual Channel 12-Bit A/D Converter with SPI Serial Interface
页数 / 页34 / 10 — MCP3202. Note:. rm (. VDD (V). Input Frequency (kHz). FIGURE 2-25:. …
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MCP3202. Note:. rm (. VDD (V). Input Frequency (kHz). FIGURE 2-25:. FIGURE 2-28:. jection (dB). y Re. uppl. r S. o P. Ripple Frequency (kHz)

MCP3202 Note: rm ( VDD (V) Input Frequency (kHz) FIGURE 2-25: FIGURE 2-28: jection (dB) y Re uppl r S o P Ripple Frequency (kHz)

该数据表的模型线

文件文字版本

MCP3202 Note:
Unless otherwise indicated, VDD = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 18* fSAMPLE, TA = +25°C. 12.0 12.0 V f DD = 5V SAMPLE = 50ksps 11.5 FSAMPLE = 100 ksps 11.5 11.0
s)
11.0
s)
10.5
rm ( rm
10.5 f
( B
SAMPLE = 100 ksps 10.0
B O O
10.0 9.5
EN EN
9.0 9.5 VDD = 2.7V 8.5 9.0 FSAMPLE = 50 ksps 2.0 2.5 3.0 3.5 4.0 4.5 5.0 8.0 1 10 100
VDD (V) Input Frequency (kHz) FIGURE 2-25:
Effective Number of Bits
FIGURE 2-28:
Effective Number of Bits (ENOB) vs. VDD. (ENOB) vs. Input Frequency. 0 100 90 VDD = 5V -10 80 fSAMPLE = 100 ksps -20
)
70
B
-30
d
60
( jection (dB)
50
R
V -40
D
DD = 2.7V 40 f
y Re
-50
SF
SAMPLE = 50 ksps 30 20 -60
uppl
10
r S
-70 0
we
-80 1 10 100
o P
1 10 100 1000 10000
Input Frequency (kHz) Ripple Frequency (kHz) FIGURE 2-26:
Spurious Free Dynamic
FIGURE 2-29:
Power Supply Rejection Range (SFDR) vs. Input Frequency. (PSR) vs. Ripple Frequency. 0 0 -10 V -10 V DD = 5V DD = 2.7V -20 f -20 fSAMPLE = 50 ksps -30 SAMPLE = 100 ksps
)
-30
B)
-40 f
d
f
B
INPUT = 9.985 kHz -40 INPUT = 998.76 Hz
(
-50 4096 points
(d
-50 4096 points -60 -60 -70
itude
-70
itude
-80
pl
-80
pl
-90 -90
m Am
-100
A
-100 -110 -110 -120 -120 -130 -130 0 10000 20000 30000 40000 50000 0 5000 10000 15000 20000 25000
Frequency (Hz) Frequency (Hz) FIGURE 2-27:
Frequency Spectrum of
FIGURE 2-30:
Frequency Spectrum of 10 kHz input (Representative Part). 1 kHz input (Representative Part, VDD = 2.7V). DS21034F-page 10  1999-2011 Microchip Technology Inc. Document Outline MCP3202 - 2.7V Dual Channel 12-Bit A/D Converter with SPI Serial Interface Functional Block Diagram Package Types 1.0 Electrical Characteristics Absolute Maximum Ratings † FIGURE 1-1: Serial Timing. FIGURE 1-2: Test Circuits. 2.0 Typical Performance Characteristics FIGURE 2-1: Integral Nonlinearity (INL) vs. Sample Rate. FIGURE 2-2: Integral Nonlinearity (INL) vs. VDD. FIGURE 2-3: Integral Nonlinearity (INL) vs. Code (Representative Part). FIGURE 2-4: Integral Nonlinearity (INL) vs. Sample Rate (VDD = 2.7V). FIGURE 2-5: Integral Nonlinearity (INL) vs. VDD. FIGURE 2-6: Integral Nonlinearity (INL) vs. Code (Representative Part, VDD = 2.7V). FIGURE 2-7: Integral Nonlinearity (INL) vs. Temperature. FIGURE 2-8: Differential Nonlinearity (DNL) vs. Sample Rate. FIGURE 2-9: Differential Nonlinearity (DNL) vs. VDD. FIGURE 2-10: Integral Nonlinearity (INL) vs. Temperature (VDD = 2.7V). FIGURE 2-11: Differential Nonlinearity (DNL) vs. Sample Rate (VDD = 2.7V). FIGURE 2-12: Differential Nonlinearity (DNL) vs. VDD. FIGURE 2-13: Differential Nonlinearity (DNL) vs. Code (Representative Part). FIGURE 2-14: Differential Nonlinearity (DNL) vs. Temperature. FIGURE 2-15: Gain Error vs. VDD. FIGURE 2-16: Differential Nonlinearity (DNL) vs. Code (Representative Part, VDD = 2.7V). FIGURE 2-17: Differential Nonlinearity (DNL) vs. Temperature (VDD = 2.7V). FIGURE 2-18: Offset Error vs. VDD. FIGURE 2-19: Gain Error vs. Temperature. FIGURE 2-20: Signal-to-Noise Ratio (SNR) vs. Input Frequency. FIGURE 2-21: Total Harmonic Distortion (THD) vs. Input Frequency. FIGURE 2-22: Offset Error vs. Temperature. FIGURE 2-23: Signal-to-Noise and Distortion (SINAD) vs. Input Frequency. FIGURE 2-24: Signal-to-Noise and Distortion (SINAD) vs. Signal Level. FIGURE 2-25: Effective Number of Bits (ENOB) vs. VDD. FIGURE 2-26: Spurious Free Dynamic Range (SFDR) vs. Input Frequency. FIGURE 2-27: Frequency Spectrum of 10 kHz input (Representative Part). FIGURE 2-28: Effective Number of Bits (ENOB) vs. Input Frequency. FIGURE 2-29: Power Supply Rejection (PSR) vs. Ripple Frequency. FIGURE 2-30: Frequency Spectrum of 1 kHz input (Representative Part, VDD = 2.7V). FIGURE 2-31: IDD vs. VDD. FIGURE 2-32: IDD vs. Clock Frequency. FIGURE 2-33: IDD vs. Temperature. FIGURE 2-34: IDDS vs. VDD. FIGURE 2-35: IDDS vs. Temperature. FIGURE 2-36: Analog Input leakage current vs. Temperature. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Inputs (CH0/CH1) 3.2 Chip Select/Shutdown (CS/SHDN) 3.3 Serial Clock (CLK) 3.4 Serial Data Input (DIN) 3.5 Serial Data Output (DOUT) 4.0 Device Operation 4.1 Analog Inputs 4.2 Digital Output Code EQUATION 4-1: FIGURE 4-1: Analog Input Model. FIGURE 4-2: Maximum Clock Frequency vs. Input Resistance (RS) to maintain less than a 0.1 LSB deviation in INL from nominal conditions. 5.0 Serial Communications 5.1 Overview TABLE 5-1: Configuration Bits for the MCP3202 FIGURE 5-1: Communication with the MCP3202 using MSB first format only. FIGURE 5-2: Communication with MCP3202 using LSB first format. 6.0 Applications Information 6.1 Using the MCP3202 with Microcontroller (MCU) SPI Ports FIGURE 6-1: SPI Communication using 8-bit segments (Mode 0,0: SCLK idles low). FIGURE 6-2: SPI Communication using 8-bit segments (Mode 1,1: SCLK idles high). 6.2 Maintaining Minimum Clock Speed 6.3 Buffering/Filtering the Analog Inputs FIGURE 6-3: The MCP601 Operational Amplifier is used to implement a 2nd order anti- aliasing filter for the signal being converted by the MCP3202. 6.4 Layout Considerations FIGURE 6-4: VDD traces arranged in a ‘Star’ configuration in order to reduce errors caused by current return paths. 7.0 Packaging Information 7.1 Package Marking Information Appendix A: Revision History Worldwide Sales and Service