link to page 10 MCP4902/4912/4922Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V, VREF = 2.048V, Gain = 2x, RL = 5 k, CL = 100 pF. 2.52201.5-21INL (LSB)-40.5Absolute INL (LSB)0-6-40-2002040608010012001024204830724096Ambient Temperature (ºC)Code (Decimal)FIGURE 2-7: Absolute INL vs. FIGURE 2-10: INL vs. Code (MCP4922). Temperature (MCP4922). Note: Single device graph (Figure 2-10) for illustration of 64 code effect. 30.2Temp = - 40oC to +125oC2.520.1) B1.5S L0( L1DNAbsolute INL (LSB)0.5-0.1012345-0.20128256384512640768896 1024Voltage Reference (V)CodeFIGURE 2-8: Absolute INL vs. VREF FIGURE 2-11: DNL vs. Code and (MCP4922). Temperature (MCP4912). 3VREF1.5212345.510.585oC0) B -0.5S-1(LINL (LSB)L -1.5-2IN25oC-3-2.5- 40oC125oC-401024204830724096-3.5Code (Decimal)0128256384512640768896 1024CodeFIGURE 2-9: INL vs. Code and VREF FIGURE 2-12: INL vs. Code and (MCP4922). Temperature (MCP4912). DS22250A-page 10 2010 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics FIGURE 1-1: SPI Input Timing Data. 2.0 Typical Performance Curves FIGURE 2-1: DNL vs. Code (MCP4922). FIGURE 2-2: DNL vs. Code and Temperature (MCP4922). FIGURE 2-3: DNL vs. Code and VREF, Gain = 1 (MCP4922). FIGURE 2-4: Absolute DNL vs. Temperature (MCP4922). FIGURE 2-5: Absolute DNL vs. Voltage Reference (MCP4922). FIGURE 2-6: INL vs. Code and Temperature (MCP4922). FIGURE 2-7: Absolute INL vs. Temperature (MCP4922). FIGURE 2-8: Absolute INL vs. VREF (MCP4922). FIGURE 2-9: INL vs. Code and VREF (MCP4922). FIGURE 2-10: INL vs. Code (MCP4922). FIGURE 2-11: DNL vs. Code and Temperature (MCP4912). FIGURE 2-12: INL vs. Code and Temperature (MCP4912). FIGURE 2-13: DNL vs. Code and Temperature (MCP4902). FIGURE 2-14: INL vs. Code and Temperature (MCP4902). FIGURE 2-15: IDD vs. Temperature and VDD. FIGURE 2-16: IDD Histogram (VDD = 2.7V). FIGURE 2-17: IDD Histogram (VDD = 5.0V). FIGURE 2-18: Hardware Shutdown Current vs. Ambient Temperature and VDD. FIGURE 2-19: Software Shutdown Current vs. Ambient Temperature and VDD. FIGURE 2-20: Offset Error vs. Ambient Temperature and VDD. FIGURE 2-21: Gain Error vs. Ambient Temperature and VDD. FIGURE 2-22: VIN High Threshold vs Ambient Temperature and VDD. FIGURE 2-23: VIN Low Threshold vs Ambient Temperature and VDD. FIGURE 2-24: Input Hysteresis vs. Ambient Temperature and VDD. FIGURE 2-25: VREF Input Impedance vs. Ambient Temperature and VDD. FIGURE 2-26: VOUT High Limit vs. Ambient Temperature and VDD. FIGURE 2-27: VOUT Low Limit vs. Ambient Temperature and VDD. FIGURE 2-28: IOUT High Short vs. Ambient Temperature and VDD. FIGURE 2-29: IOUT vs VOUT. Gain = 1x. FIGURE 2-30: VOUT Rise Time. FIGURE 2-31: VOUT Fall Time. FIGURE 2-32: VOUT Rise Time. FIGURE 2-33: VOUT Rise Time. FIGURE 2-34: VOUT Rise Time Exit Shutdown. FIGURE 2-35: PSRR vs. Frequency. FIGURE 2-36: Multiplier Mode Bandwidth. FIGURE 2-37: -3 db Bandwidth vs. Worst Codes. FIGURE 2-38: Phase Shift. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Supply Voltage Pins (VDD, VSS) 3.2 Chip Select (CS) 3.3 Serial Clock Input (SCK) 3.4 Serial Data Input (SDI) 3.5 Latch DAC Input (LDAC) 3.6 Hardware Shutdown Input (SHDN) 3.7 Analog Outputs (VOUTA, VOUTB) 3.8 Voltage Reference Inputs (VREFA, VREFB) 4.0 General Overview TABLE 4-1: LSb of each device 4.1 DC Accuracy FIGURE 4-1: Example for INL Error. FIGURE 4-2: Example for DNL Accuracy. 4.2 Circuit Descriptions FIGURE 4-3: Typical Transient Response. FIGURE 4-4: Output Stage for Shutdown Mode. 5.0 Serial Interface 5.1 Overview 5.2 Write Command FIGURE 5-1: Write Command for MCP4922 (12-bit DAC). FIGURE 5-2: Write Command for MCP4912 (10-bit DAC). FIGURE 5-3: Write Command for MCP4902 (8-bit DAC). 6.0 Typical Applications 6.1 Digital Interface 6.2 Power Supply Considerations FIGURE 6-1: Typical Connection Diagram. 6.3 Layout Considerations 6.4 Single-Supply Operation 6.5 Bipolar Operation 6.6 Selectable Gain and Offset Bipolar Voltage Output Using a Dual DAC 6.7 Designing a Double-Precision DAC Using a Dual DAC 6.8 Building Programmable Current Source 6.9 Using Multiplier Mode 7.0 Development support 7.1 Evaluation and Demonstration Boards 8.0 Packaging Information 8.1 Package Marking Information Trademarks Worldwide Sales and Service