Datasheet LTC5505-1, LTC5505-2 (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | RF Power Detector with Buffered Output and >40dB Dynamic Range |
| 页数 / 页 | 8 / 7 — TYPICAL APPLICATIO. Dual Band Mobile Phone Tx Power Control with … |
| 文件格式/大小 | PDF / 150 Kb |
| 文件语言 | 英语 |
TYPICAL APPLICATIO. Dual Band Mobile Phone Tx Power Control with Directional Coupler. PACKAGE DESCRIPTIO. S5 Package
该数据表的模型线
文件文字版本
LTC5505-1/LTC5505-2
U TYPICAL APPLICATIO Dual Band Mobile Phone Tx Power Control with Directional Coupler
0Ω TO 20Ω 33pF LTC5505-X 1 5 V RF CC IN 2 0.1µF Li-Ion GND BSEL 3 4 V DISABLE ENABLE SHDN OUT DIRECTIONAL 900MHz Tx PA MODULE COUPLER DIPLEXER INPUT 1.8GHz 900MHz INPUT OUTPUT MOBILE PHONE 1.8GHz DSP VPC OUTPUT 50Ω 5505 TA02
U PACKAGE DESCRIPTIO S5 Package 5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635) 2.90 BSC (NOTE 4) 0.754 0.854 ± 0.127 3.254 1.50 – 1.75 2.80 BCS (NOTE 4) 0.95 BSC PIN ONE 1.9 BSC RECOMMENDED SOLDER PAD LAYOUT 0.30 – 0.45 TYP 0.95 BSC 5 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.35 – 0.50 REF 0.09 – 0.20 1.90 BSC NOTE: (NOTE 3) S5 TSOT-23 0801 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 5505f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 7
U TYPICAL APPLICATIO Dual Band Mobile Phone Tx Power Control with Directional Coupler
0Ω TO 20Ω 33pF LTC5505-X 1 5 V RF CC IN 2 0.1µF Li-Ion GND BSEL 3 4 V DISABLE ENABLE SHDN OUT DIRECTIONAL 900MHz Tx PA MODULE COUPLER DIPLEXER INPUT 1.8GHz 900MHz INPUT OUTPUT MOBILE PHONE 1.8GHz DSP VPC OUTPUT 50Ω 5505 TA02
U PACKAGE DESCRIPTIO S5 Package 5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635) 2.90 BSC (NOTE 4) 0.754 0.854 ± 0.127 3.254 1.50 – 1.75 2.80 BCS (NOTE 4) 0.95 BSC PIN ONE 1.9 BSC RECOMMENDED SOLDER PAD LAYOUT 0.30 – 0.45 TYP 0.95 BSC 5 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.35 – 0.50 REF 0.09 – 0.20 1.90 BSC NOTE: (NOTE 3) S5 TSOT-23 0801 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 5505f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 7