Datasheet MCP1804 (Microchip) - 5

MCP1804 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications:
Unless otherwise specified, all limits are established for VIN = VR + 2.0V,
Note 1
, COUT = 1 µF (X7R), CIN = 1 µF (X7R), VSHDN = VIN, TA = +25°C
Parameters Sym. Min. Typ. Max. Units Conditions
Power Supply Ripple PSRR — 50 — dB f = 1 kHz, IL = 20 mA, Rejection Ratio VIN_AC = 0.5V pk-pk, CIN = 0 µF Thermal Shutdown TSD — 150 — °C TJ = 150°C Protection Thermal Shutdown TSD — 25 — °C Hysteresis
Note 1:
The minimum VIN must meet one condition: VIN  (VR + 2.0V).
2:
VR is the nominal regulator output voltage with an input voltage of VIN = VR + 2.0V. For example: VR = 1.8V, 2.5V, 3.0V, 3.3V, etc.
3:
TCVOUT = (VOUT-HIGH - VOUT-LOW) * 106 / (VR * Temperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range.
4:
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCVOUT.
5:
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured value with an applied input voltage of VR + 2.0V.
TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges
Operating Temperature Range TA -40 — +85 °C Operating Junction Temperature T Range J -40 — +125 °C Storage Temperature Range TA -55 — +125 °C
Thermal Package Resistance
Thermal Resistance, 3LD SOT-89 JA — 180 — EIA/JEDEC® JESD51-7 °C/W  FR-4 0.063 4-Layer Board JC — 52 — Thermal Resistance, 3LD SOT-223 JA — 62 — EIA/JEDEC JESD51-7 °C/W  FR-4 0.063 4-Layer Board JC — 15 — Thermal Resistance, 5LD SOT-23 JA — 256 — EIA/JEDEC JESD51-7 °C/W  FR-4 0.063 4-Layer Board JC — 81 — Thermal Resistance, 5LD SOT-89 JA — 180 — EIA/JEDEC JESD51-7 °C/W  FR-4 0.063 4-Layer Board JC — 52 —  2009-2013 Microchip Technology Inc. DS20002200D-page 5 Document Outline Features Applications Related Literature Description Package Types Functional Block Diagram Typical Application Circuit 1.0 Electrical Characteristics Absolute Maximum Ratings 2.0 Typical Performance Curves FIGURE 2-1: Output Voltage vs. Output Current. FIGURE 2-2: Output Voltage vs. Output Current. FIGURE 2-3: Output Voltage vs. Output Current. FIGURE 2-4: Output Voltage vs. Output Current. FIGURE 2-5: Output Voltage vs. Output Current. FIGURE 2-6: Output Voltage vs. Output Current. FIGURE 2-7: Output Voltage vs. Input Voltage. FIGURE 2-8: Output Voltage vs. Input Voltage. FIGURE 2-9: Output Voltage vs. Input Voltage. FIGURE 2-10: Output Voltage vs. Input Voltage. FIGURE 2-11: Output Voltage vs. Input Voltage. FIGURE 2-12: Output Voltage vs. Input Voltage. FIGURE 2-13: Dropout Voltage vs. Load Current. FIGURE 2-14: Dropout Voltage vs. Load Current. FIGURE 2-15: Dropout Voltage vs. Load Current. FIGURE 2-16: Supply Current vs. Input Voltage. FIGURE 2-17: Supply Current vs. Input Voltage. FIGURE 2-18: Supply Current vs. Input Voltage. FIGURE 2-19: Supply Current vs. Input Voltage. FIGURE 2-20: Supply Current vs. Input Voltage. FIGURE 2-21: Supply Current vs. Input Voltage. FIGURE 2-22: Output Voltage vs. Ambient Temperature. FIGURE 2-23: Output Voltage vs. Ambient Temperature. FIGURE 2-24: Output Voltage vs. Ambient Temperature. FIGURE 2-25: Dynamic Line Response. FIGURE 2-26: Dynamic Line Response. FIGURE 2-27: Dynamic Line Response. FIGURE 2-28: Dynamic Line Response. FIGURE 2-29: Dynamic Line Response. FIGURE 2-30: Dynamic Line Response. FIGURE 2-31: Dynamic Load Response. FIGURE 2-32: Dynamic Load Response. FIGURE 2-33: Dynamic Load Response. FIGURE 2-34: Start-up Response. FIGURE 2-35: Start-up Response. FIGURE 2-36: Start-up Response. FIGURE 2-37: Start-up Response. FIGURE 2-38: Start-up Response. FIGURE 2-39: Start-up Response. FIGURE 2-40: SHDN Response. FIGURE 2-41: SHDN Response. FIGURE 2-42: SHDN Response. FIGURE 2-43: SHDN Response. FIGURE 2-44: SHDN Response. FIGURE 2-45: SHDN Response. FIGURE 2-46: PSRR 3.3V @ 1 mA. FIGURE 2-47: PSRR 5.0V @ 1 mA. FIGURE 2-48: PSRR 12.0V @ 1 mA. FIGURE 2-49: PSRR 3.3V @ 30 mA. FIGURE 2-50: PSRR 5.0V @ 30 mA. FIGURE 2-51: PSRR 12V @ 30 mA. FIGURE 2-52: Ground Current vs. Output Current. FIGURE 2-53: Ground Current vs. Output Current. FIGURE 2-54: Ground Current vs. Output Current. FIGURE 2-55: Output Noise vs. Frequency. 3.0 Pin Descriptions TABLE 3-1: MCP1804 Pin Function Table 3.1 Unregulated Input Voltage (VIN) 3.2 Ground Terminal (GND) 3.3 Shutdown Input (SHDN) 3.4 Regulated Output Voltage (VOUT) 3.5 No Connect (NC) 4.0 Detailed Description 4.1 Output Regulation 4.2 Overcurrent 4.3 Shutdown 4.4 Output Capacitor 4.5 Input Capacitor 4.6 Thermal Shutdown FIGURE 4-1: Block Diagram. 5.0 Functional Description 5.1 Input 5.2 Output 6.0 Application Circuits and Issues 6.1 Typical Application FIGURE 6-1: Typical Application Circuit. 6.1.1 Application Input Conditions 6.2 Power Calculations 6.2.1 Power Dissipation 6.3 Voltage Regulator 6.3.1 Power Dissipation Example 6.3.1.1 Device Junction Temperature Rise 6.3.1.2 Junction Temperature Estimate 6.4 Voltage Reference FIGURE 6-2: Using the MCP1804 as a Voltage Reference. 6.5 Pulsed Load Applications 7.0 Packaging Information 7.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service